Holding apparatus, exposure apparatus, exposure metod, and device manufacturing method

ABSTRACT

A holding apparatus is provided with a holding member that has a holding surface that holds a substrate on which a pattern is to be formed, a plurality of first electrode members that are provided on the holding member and that generate electrostatic force in accordance with supplied voltage in order to attract the substrate to the holding surface, and a power supply device that is able to supply voltage to the first electrode members. The first electrode members are positioned in accordance with pattern information.

CROSS-REFERENCE TO RELATED APPLICATION

This application is non-provisional application claiming benefit ofprovisional application No. 60/907,051, filed Mar. 19, 2007, thecontents of which are incorporated herein by reference.

BACKGROUND

1. Field of the Invention

The present invention relates to a holding apparatus that holds asubstrate, an exposure apparatus that exposes a substrate, an exposuremethod, and a device manufacturing method.

2. Description of Related Art

A semiconductor device manufacturing apparatus is provided with aholding apparatus that holds a substrate on which a device is beingmanufactured. For example, EUV apparatuses and CVD apparatuses areprovided with a holding apparatus that holds a substrate using staticelectricity such as that disclosed in U.S. Pat. No. 5,708,856.

In a manufacturing apparatus, an operation to transport a substrate ontoa holding apparatus, an operation to hold the transported substrate onthe holding apparatus, and an operation to transport the substrate awayfrom the holding apparatus are executed. In order to manufacture asuperior device with excellent productivity, it is desirable for theholding apparatus to be able to execute the above described operationsrapidly and efficiently. In a holding apparatus that uses staticelectricity, if, for example, there are delays in an operation totransport a substrate away which are caused by static electricity, thereis a possibility that there will be a deterioration in deviceproductivity. Moreover, when a substrate is being transported onto theholding apparatus, if the substrate shifts from a desired position, orwhen the substrate is being transported away from the holding apparatus,if a load is applied to the substrate, there is a possibility that theperformance of the device being manufactured will deteriorate.

A purpose of some aspects illustrating the present invention is toprovide a holding apparatus that is capable of rapidly executing atleast one of an operation to transport in a substrate, an operation tohold a substrate, and an operation to transport a substrate away, andthat is capable of contributing to an improvement in deviceproductivity. Another purpose is to provide an exposure apparatus and anexposure method that are capable of contributing to an improvement inproductivity using this holding apparatus. Further another purpose is toprovide a device manufacturing method that uses this exposure apparatusand exposure method.

SUMMARY

In accordance with a first aspect illustrating the present invention,there is provided a holding apparatus that includes: a holding memberthat has a holding surface, the holding surface holding a substrate onwhich a pattern is to be formed; a plurality of first electrode membersthat are provided on the holding member and that are arranged inaccordance with pattern information relating to the pattern, and thatgenerate electrostatic force in accordance with supply of a voltage inorder to attract the substrate to the holding surface.

According to the first aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a second aspect illustrating the present invention,there is provided a holding apparatus that includes: a holding memberthat has a holding surface, the holding surface holding a substrate onwhich a pattern is to be formed; a plurality of first electrode membersthat are provided on the holding member, and that generate electrostaticfield in accordance with supply of a voltage in order to attract thesubstrate to the holding surface; and a power supply device that iscapable of regulating the voltage in accordance with pattern informationrelating to the pattern.

According to the second aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a third aspect illustrating the present invention,there is provided a holding apparatus that includes: a holding memberthat has a holding surface that holds a substrate; at least one firstelectrode member that is provided on the holding member, and thatgenerates electrostatic field in accordance with supply of a voltage inorder to attract the substrate to the holding surface; and a movingmechanism that has a supporting surface that supports the substrate andthat comprises a moving member that moves the substrate relative to theholding member while supporting a predetermined area of the substratesuch that the holding surface and the substrate are separated from eachother, and a second electrode member that is provided on the movingmember, and that generates electrostatic field in accordance with supplyof a voltage in order to attract the substrate to the supportingsurface.

According to the third aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a fourth aspect illustrating the present invention,there is provided a holding apparatus that includes: a holding memberthat has a holding surface that holds a substrate; an electrode memberthat is provided on the holding member and generate electrostatic forcein order to cause the substrate to adhere to the holding surface; amoving mechanism that moves the substrate and the holding memberrelatively to each other such that the holding surface and the substrateare separated from each other; and an antistatic device that removeselectrostatic charge on the substrate when the holding member and thesubstrate are being separated from each other.

According to the fourth aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a fifth aspect illustrating the present invention,there is provided an exposure apparatus that exposes a substrate withexposure light from a pattern, wherein, in order to hold a substrateonto which the exposure light has been irradiated, there is provided theholding apparatus according to the above described aspects.

According to the fifth aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a sixth aspect illustrating the present invention,there is provided a device manufacturing method that includes exposing asubstrate using the exposure apparatus according to the above describedaspects, and developing the exposed substrate.

According to the sixth aspect, it is possible to manufacture a deviceusing an exposure apparatus that is able to contribute to an improvementin device productivity while preventing any deterioration in the deviceperformance.

In accordance with a seventh aspect illustrating the present invention,there is provided an exposure method for exposing a substrate withexposure light from a pattern, the method includes: mounting thesubstrate on a holding surface of a holding member on which a pluralityof first electrode members are provided; supplying voltage to the firstelectrode members in order to cause the substrate to adhere to theholding surface by means of electrostatic force; and irradiating thesubstrate with the exposure light from the pattern, wherein the value ofa first voltage that is supplied to the first electrode members, whichcorrespond to an area on the substrate where the irradiation of theexposure light is currently underway, is higher than the value of asecond voltage that is supplied to at least a part of remaining portionof the first electrode members.

According to the seventh aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with an eighth aspect illustrating the present invention,there is provided an exposure method for exposing a substrate withexposure light from a pattern, the method includes: mounting thesubstrate on a holding surface of a holding member on which a pluralityof first electrode members are provided; supplying voltage to the firstelectrode members in order to cause the substrate to adhere to theholding surface by means of electrostatic force; and sequentiallyirradiating shot areas on the substrate with exposure light from thepattern, wherein the value of a first voltage that is supplied to thefirst electrode members, which correspond to shot areas where theirradiation of the exposure light has not yet been formed and where theirradiation of the exposure light is currently underway, is higher thanthe value of a second voltage that is supplied to the first electrodemembers, which are different from the first electrode members to whichthe first voltage is supplied.

According to the eighth aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a ninth aspect illustrating the present invention,there is provided an exposure method for exposing a substrate withexposure light which includes: mounting the substrate on a holdingsurface of a holding member on which a first electrode member isprovided; supplying voltage to the first electrode member in order tocause the substrate to adhere to the holding surface by means ofelectrostatic force; exposing the substrate by irradiating exposurelight onto the substrate while it is being held on the holding surface;and separating the exposed substrate and the holding surface, whereinvoltage is supplied to a second electrode member that is provided on amoving member which has a supporting surface which is able to supportthe substrate in order to cause the substrate to adhere to thesupporting surface by means of electrostatic force, and, when thesupporting surface and the substrate are adhered together by means ofelectrostatic force, the substrate and the holding surface are separatedby moving the moving members.

According to the ninth aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with a tenth aspect illustrating the present invention,there is provided an exposure method for exposing a substrate withexposure light which includes: mounting the substrate on a holdingsurface of a holding member on which a first electrode member isprovided; supplying voltage to the first electrode member in order tocause the substrate to adhere to the holding surface by means ofelectrostatic force; exposing the substrate by irradiating exposurelight onto the substrate while it is being held on the holding surface;and separating the exposed substrate and the holding surface, whereinelectrostatic charge on the substrate is removed when the holding memberand the substrate are being separated from each other.

According to the tenth aspect, it is possible to contribute to animprovement in device productivity while preventing any deterioration inthe device performance.

In accordance with an eleventh aspect illustrating the presentinvention, there is provided a device manufacturing method that includesexposing a substrate using the exposure method according to the abovedescribed aspects, and developing the exposed substrate.

According to the eleventh aspect, it is possible to manufacture a deviceusing an exposure apparatus that is able to contribute to an improvementin device productivity while preventing any deterioration in the deviceperformance.

According to some aspects illustrating the present invention, it ispossible to execute at least one of an operation to transport in asubstrate, an operation to hold a substrate, and an operation totransport a substrate away and the like, so that it is possible tomanufacture a device with excellent productivity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a typical view showing an example of an exposure apparatusaccording to a first embodiment.

FIG. 2 is a plan view showing a portion of a substrate stage accordingto the first embodiment.

FIG. 3 is a side view showing a portion of the substrate stage accordingto the first embodiment.

FIG. 4 is a side cross-sectional view showing a portion of the substratestage according to the first embodiment.

FIG. 5 is a plan view in order to illustrate a first and secondsupporting member according to the first embodiment.

FIG. 6 is a typical view showing a relationship between a holding memberand shot areas on a substrate.

FIG. 7A is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 7B is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 7C is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 8 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 9 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 10 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 11 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 12A is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 12B is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 12C is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 13 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 14 is a view in order to illustrate an example of an operation ofan exposure apparatus according to a second embodiment.

FIG. 15 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the second embodiment.

FIG. 16 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the second embodiment.

FIG. 17 is a view in order to illustrate an example of an operation ofan exposure apparatus according to a third embodiment.

FIG. 18 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the third embodiment.

FIG. 19 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the third embodiment.

FIG. 20 is a view in order to illustrate an example of an operation ofan exposure apparatus according to a fourth embodiment.

FIG. 21 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the fourth embodiment.

FIG. 22 is a view in order to illustrate an example of an operation ofthe exposure apparatus according to the fourth embodiment.

FIG. 23 is a plan view showing a portion of a substrate stage accordingto a fifth embodiment 1.

FIG. 24 is a view in order to illustrate an example of an operation ofan exposure apparatus according to the fifth embodiment.

FIG. 25 is a view in order to illustrate an example of an operation ofan exposure apparatus according to the fifth embodiment.

FIG. 26 is a view in order to illustrate an example of an operation ofan exposure apparatus according to a sixth embodiment.

FIG. 27 is a view in order to illustrate an example of an operation ofan exposure apparatus according to the sixth embodiment.

FIG. 28 is a perspective view showing an example of a moving mechanismaccording to a seventh embodiment.

FIG. 29 is a view in order to illustrate an example of an operation ofthe moving mechanism according to the seventh embodiment.

FIG. 30 is a flowchart showing an example of a micro devicemanufacturing processes.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention are described by providing exampleswith reference made to the drawings, however, the present invention isnot limited to these embodiments. Note that in the description below, anXYZ rectangular coordinate system is set, and positional relationshipsbetween respective components are described with reference made to thisXYZ rectangular coordinate system. A predetermined direction within ahorizontal plane is taken as an X axial direction, a direction which isorthogonal to the X axial direction within the horizontal plane is takenas a Y axial direction, while a direction which is orthogonal to boththe X axial direction and the Y axial direction (namely, a verticaldirection) is taken as a Z axial direction. Moreover, rotation (i.e.,tilt) directions around the X axis, the Y axis, and the Z axis are takenrespectively as θX, θY, and θZ directions.

First Embodiment

A first embodiment will now be described. FIG. 1 is a schematicstructural view showing an exposure apparatus EX according to the firstembodiment. In FIG. 1, the exposure apparatus EX is provided with a maskstage 1 that is capable of moving while holding a mask M on which apredetermined pattern has been formed, a substrate stage 2 which iscapable of moving while holding a substrate P on which a pattern hasbeen formed, an interferometric system 16 which measures positionalinformation of the respective stages, an illumination optical system ILwhich illuminates the mask M held on the mask stage 1 with exposurelight EL, a projection optical system PL which projects an image of thepattern on the mask M which is being illuminated by the exposure lightEL onto the substrate P, a chamber apparatus (a vacuum chamber) 6 whichhas a vacuum system which maintains in a vacuum state at least apredetermined space through which the exposure light EL is transmitted,and a control unit 5 which controls the overall operations of theexposure apparatus EX. The vacuum system maintains a vacuum in internalspace of the chamber apparatus 6. An input device 7 which is capable ofinputting various signals and information relating to exposure, and astorage device 8 which stores various information relating to exposureare connected to the control unit 5. The input device 7 may be, forexample, a keyboard, a touch panel, a mouse, or the like. The substrateP may be a substrate which has a film of photosensitive material (i.e.,resist) or the like formed on one surface of a base material such as asemiconductor wafer. The mask M may be a reticle on which a devicepattern which is to be projected onto the substrate P is formed.

The exposure apparatus EX of the present embodiment is an EUV exposureapparatus that exposes the substrate P using extreme ultraviolet light.Extreme ultraviolet light is formed by electromagnetic waves of, forexample, approximately 5 to 50 nm in the soft X-ray region. In thedescription below, extreme ultraviolet light is referred to as EUV lightwhere this is appropriate.

In the present embodiment, the mask is a reflective mask having amultilayer film that is capable of reflecting EUV light. The exposureapparatus EX illuminates a surface (i.e., a reflective surface) of amask M on which a pattern has been formed in the multilayer film usingexposure light (i.e., EUV light) EL, so as to expose the photosensitivesubstrate P with the exposure light EL reflected by the mask M. Theexposure light (i.e., EUV light) EL is irradiated in a vacuum state (forexample, in a reduced pressure atmosphere of approximately 10⁻⁴ Pa) ontoeach optical element of the mask M, the substrate P, and theillumination optical system IL, and onto each optical element of theprojection optical system PL.

The exposure apparatus EX of the present embodiment is what is known asa scanning stepper which is a scanning type of exposure apparatus thatprojects an image of the pattern on the mask M onto the substrate Pwhile moving the mask M and the substrate P in synchronization in apredetermined direction. In the present embodiment, the scanningdirection of the substrate P (i.e., the direction of the synchronizedmovement) is set to the Y axial direction, while the scanning directionof the mask M (i.e., the direction of the synchronized movement) is alsoset to the Y axial direction. At the same time as the exposure apparatusEX moves the substrate P in the Y axial direction relative to aprojection region PR of the projection optical system PL and, insynchronization with this movement of the substrate P in the Y axialdirection, moves the mask M in the Y axial direction relative to theillumination region IR of the illumination optical system IL, it alsoilluminates the mask M with the exposure light EL, and irradiates theexposure light EL from the mask M onto the substrate P so as to exposethe substrate P.

The illumination optical system IL includes a plurality of opticalelements IR₁ to IR₄, and illuminates a predetermined illumination regionIR on the mask M with exposure light EL which has a uniform illuminancedistribution. The optical elements IR₁ to IR₄ may be multilayer filmreflecting mirrors which are provided with a multilayer film capable ofreflecting EUV light. The multilayer film of the optical elements IR₁ toIR₄ may be, for example, a Mo/Si multilayer film. The respective opticalelements IR₁ to IR₄ are held in a lens barrel (not shown).

The illumination optical system IL illuminates the mask M with exposurelight EL from a light source 4. The light source 4 of the presentembodiment is a laser excitation type of plasma light source, andincludes a housing 9, a laser device 10 that irradiates laser light, anda supply component 11 that supplies a target material such as xenon gasor the like to the interior of the housing 9. Laser light that isirradiated from the laser device 10 and condensed by a condensingoptical system 12 is irradiated onto the target material that isdischarged from a distal end of the supply component 11. The targetmaterial onto which the laser light is irradiated changes into plasmaand generates light (i.e., the exposure light EL) that includes EUVlight. The light that is generated at the distal end of the supplycomponent 11 is condensed by a condenser 13. Light that has passedthrough the condenser 13 enters into a collimator mirror 14 that isplaced on the outer side of the housing 9. Note that the light source 4may be an electrical discharge type of plasma light source or maybeanother type of light source.

The mask stage 1 is a six degrees of freedom stage which is capable ofmoving in six directions, namely, in the X axial direction, the Y axialdirection, the Z axial direction, the θX direction, the θY direction,and the θZ direction while holding the mask M. In the presentembodiment, the mask stage 1 holds a mask M such that the reflectivesurface of the mask M is substantially parallel with the XY plane.Moreover, in the present embodiment, the mask stage 1 holds the mask Msuch that the reflective surface of the mask M faces in the −Zdirection. Positional information of the mask stage 1 (i.e., the mask M)is measured by a laser interferometer 16M of the interferometric system16. The laser interferometer 16M measures positional information for themask stage 1 in the X axial, Y axial, and θZ directions using ameasuring mirror 1R which is provided on the mask stage 1. Moreover,surface position information (i.e., position information relating to theZ axial, the θX, and the θY directions) for the reflective surface ofthe mask M which is held on the mask stage 1 is detected by a focusingand leveling detection system (not shown). The control unit 5 controlsthe position of the mask M which is held on the mask stage 1 based onmeasurement results from the laser interferometer 16M and on detectionresults from the focusing and leveling detection system.

The projection optical system PL includes a plurality of opticalelements PR₁ to PR₄, and projects an image of the pattern on the mask Monto the substrate P at a predetermined projection magnification. Theoptical elements PR₁ to PR₄ may be multilayer film reflecting mirrorsthat are provided with a multilayer film capable of reflecting EUVlight. The multilayer film of the optical elements PR₁ to PR₄ may be,for example, a Mo/Si multilayer film. The respective optical elementsPR₁ to PR₄ are held in a lens barrel (not shown). Moreover, in thepresent embodiment, the respective optical elements PR₁ to PR₄ of theprojection optical system PL are housed in a dedicated vacuum chamber(lens barrel) 15. Note that it is not necessary for this dedicatedvacuum chamber to be provided.

The substrate stage 2 includes a holding member 20 that has a holdingsurface 19 that holds a substrate P on which a pattern is formed as aresult of exposure light EL from the pattern on the mask M beingirradiated thereon, and a stage body 21 that supports the holding member20. The substrate stage 2 is able to move in the X axial direction, theY axial direction, the Z axial direction, the θX direction, the θYdirection, and the AZ direction while holding a substrate P by means ofthe holding member 20. In the present embodiment, the substrate stage 2holds the substrate P such that a surface of the substrate (i.e., anexposure surface) is substantially parallel with the XY plane. Moreover,in the present embodiment, the substrate stage 2 holds the substrate Psuch that the surface of the substrate P faces in the +Z direction.Positional information of the substrate stage 2 (i.e., the substrate P)is measured by a laser interferometer 16P of the interferometric system16. The laser interferometer 16P measures positional information for thesubstrate stage 2 in the X axial, Y axial, and θZ directions using ameasuring mirror 21R which is provided on the substrate stage 2.Moreover, surface position information (i.e., position informationrelating to the Z axial, the θX, and the θY directions) for the surfaceof the substrate P which is held on the substrate stage 2 is detected bya focusing and leveling detection system (not shown). The control unit 5controls the position of the substrate P which is held on the substratestage 2 based on measurement results from the laser interferometer 16Pand on detection results from the focusing and leveling detectionsystem.

In the present embodiment, in order to expose the substrate P withexposure light EL from the pattern on the mask M, as is shown in FIG. 1,the mask M is held on the mask stage 1, and the substrate P is held onthe holding member 20 of the substrate stage 2. The mask M that is heldon the mask stage 1 is illuminated by exposure light (i.e., EUV light)EL that has been emitted from the light source 4 and has passed throughthe illumination optical system IL. The exposure light EL emitted fromthe illumination optical system IL is incident on the reflective surfaceof the mask M. Exposure light EL that is irradiated onto the reflectivesurface of the mask M and is then reflected by this reflective surfaceis incident on the projection optical system PL from the object surfaceside of the projection optical system PL. Exposure light EL that isincident on the projection optical system PL via the object surface sideof the projection optical system PL is emitted onto the image surfaceside of the projection optical system PL, and is then irradiated ontothe surface (i.e., the exposure surface) of the substrate P. As aresult, the image of the pattern on the mask M that has been illuminatedby the exposure light EL is projected via the projection optical systemPL onto the photosensitive substrate P, thereby exposing the substrateP. In this manner, as a result of exposure light EL from the pattern onthe mask M being irradiated onto the substrate P via the projectionoptical system PL, a pattern is formed on the substrate P.

FIG. 2 is a plan view showing a portion of the substrate stage 2, whileFIG. 3 is a side view showing a portion of the substrate stage 2. InFIG. 2 and FIG. 3, the substrate stage 2 has the holding member 20 whichhas the holding surface 19 that holds the substrate P on which a patternis formed. In the present embodiment, the holding surface 19 is placedso as to be substantially parallel with the XY plane. Moreover, theholding surface 19 is placed so as to face in the +Z direction.

The substrate P has a rear surface that faces the holding surface 19,and the holding surface 19 holds the rear surface of the substrate P.The rear surface of the substrate P is the surface on the opposite sidefrom the surface where the exposure light EL is irradiated. As isdescribed above, the substrate P may be one in which a film of aphotosensitive material (i.e., resist) or the like is formed on onesurface (i.e., a surface onto which the exposure light is irradiated) ofa base material such as a semiconductor wafer and the like. In thepresent embodiment, the outer shape of the holding surface 19 issubstantially the same as the outer shape of the rear surface of thesubstrate P.

The holding member 20 of the present embodiment includes anelectrostatic chuck mechanism, and the holding surface 19 holds the rearsurface of the substrate P using electrostatic force. For example, adual stage formed by a coarse movement stage and a fine movement stagecan be used for the substrate stage 2. In the present embodiment, theholding member 20 is mounted on top of the fine movement stage (notshown). A plurality of electrode members 3 are provided on the holdingmember 20. The electrode members 3 generate electrostatic force that isused to suction a substrate P onto the holding surface 19 in accordancewith voltage which is applied thereto. That is, the voltage appliedelectrode members 3 generate electrostatic field under which thesubstrate P can be attracted to the holding surface 19. In the presentembodiment, a power supply device 22 that is capable of applying apredetermined voltage to the electrode members 3 is provided on thesubstrate stage 2. The power supply device 22 may be placed at the outerside of the vacuum chamber 6, or a different position from the substratestage 2 on the inner side of the vacuum chamber 6. The power supplydevice 22 is electrically connected by electrical wiring to theelectrode members 3. Each of the plurality of electrode members 3 has apredetermined shape and is placed in a predetermined position on theholding member 20.

The holding member 20 of the present embodiment is formed from aninsulating material such as low-expansion ceramics. At least a portionof the holding member 20 functions as a dielectric substance for theelectrostatic chuck mechanism. The electrode members 3 are placed insidethe holding member 20. The holding surface 19 is formed from aninsulating material such as the aforementioned low-expansion ceramics.

Because the holding member 20 is a low-expansion material, thermaldeformation of the holding member 20, and consequent deformation of theheld substrate P is restricted. Moreover, when measurement marks ormeasurement components or the like are provided on the holding member20, deformation all of these measurement marks and measurementcomponents is restricted.

The electrostatic chuck mechanism of the present embodiment has what isknown as a bipolar system, and includes electrode members 3 to which apositive potential is applied by the power supply device 22 andelectrode members 3 to which a negative potential is applied by thepower supply device 22.

In the description below, of the plurality of electrode members 3, theelectrode members 3 to which a positive potential is applied aresuitably referred to as positive electrodes 31, while the electrodemembers 3 to which a negative potential is applied are suitably referredto as negative electrodes 32.

A plurality of the positive electrodes 31 are provided, and a pluralityof negative electrodes 32 are provided so as to correspond to thepositive electrodes 31. As is shown in FIG. 2 and FIG. 3, in the presentembodiment, nine positive electrodes 31 (31A to 31I) and nine negativeelectrodes 32 (32A to 32I), which correspond respectively to the ninepositive electrodes 31 (31A to 31I), are provided on the holding member20.

As is shown in FIG. 2, in the present embodiment, the plurality ofpositive electrodes 31 are located in an area on the −X side of thecenter of the holding surface 19, while the plurality of negativeelectrodes 32 are located in an area on the +X side thereof.

In addition, the plurality of positive electrodes 31 extend in the Yaxial direction in the area on the −X side of the center of the holdingsurface 19. The plurality of negative electrodes 32 extend in the Yaxial direction in the area on the +X side of the center of the holdingsurface 19.

In the description given below, of the plurality of positive electrodes31 that extend in the Y axial direction, the positive electrode 31 thatis closest to the edge on the −Y side of the holding surface 19 issuitably referred to as a first positive electrode 31A, while thepositive electrode 31 that is the next closest to the edge on the −Yside of the holding surface 19 after the first positive electrode 31A isreferred to as a second positive electrode 31B. In addition, of theplurality of positive electrodes 31, the third, fourth, . . . , up tothe eighth positive electrode in sequence in the +Y direction from thesecond positive electrode 31B are referred to as a third positiveelectrode 31C, a fourth positive electrode 31D, . . . , up to an eighthpositive electrode 31H, while the positive electrode 31 that is closestto the edge on the +Y side of the holding surface 19 is suitablyreferred to as a ninth positive electrode 31I.

In the description given below, of the plurality of negative electrodes32 that extend in the Y axial direction, the negative electrode 32 thatis closest to the edge on the −Y side of the holding surface 19 issuitably referred to as a first negative electrode 32A, while thenegative electrode 32 that is the next closest to the edge on the −Yside of the holding surface 19 after the first negative electrode 32A isreferred to as a second negative electrode 32B. In addition, of theplurality of negative electrodes 32, the third, fourth, . . . , up tothe eighth negative electrode in sequence in the +Y direction from thesecond negative electrode 32B are referred to as a third negativeelectrode 32C, a fourth negative electrode 32D, . . . , up to an eighthnegative electrode 32H, while the negative electrode 32 that is closestto the edge on the +Y side of the holding surface 19 is suitablyreferred to as a ninth negative electrode 32I.

The first positive electrode 31A and the first negative electrode 32Aare positioned facing each other in the X axial direction on the XYplane. Moreover, in the present embodiment, the size of the firstpositive electrode 31A is substantially the same as the size of thefirst negative electrode 32A. Furthermore, the shape of the firstpositive electrode 31A is substantially the same as the shape of thefirst negative electrode 32A. In the present embodiment, the firstpositive electrode 31 and the first negative electrode 32 are linesymmetry with respect to the Y axis.

In the same way, each of the second, third, . . . , and ninth positiveelectrodes 31B, 31C, . . . , and 31I correspond respectively to each ofthe second, third, . . . , and ninth negative electrodes 32B, 32C, . . ., and 32I. Each of the second, third, . . . , and ninth positiveelectrodes 31B, 31C, . . . , and 31I and each of the second, third, . .. , and ninth negative electrodes 32B, 32C, . . . , and 32I arepositioned facing each other in the X axial direction on the XY plane.Each of the second, third, . . . , and ninth positive electrodes 31B,31C, . . . , and 31I and each of the second, third, . . . , and ninthnegative electrodes 32B, 32C, . . . , and 32I are line symmetry withrespect to the Y axis.

In the description given below, the first positive electrode 31A towhich a positive potential is applied and the first negative electrode32A to which a negative potential is applied are suitably referred to incombination as a first electrode pattern 3A. In the same way, the secondpositive electrode 31B and the second negative electrode 32B aresuitably referred to in combination as a second electrode pattern 3B.The third positive electrode 31C and the third negative electrode 32Care suitably referred to in combination as a third electrode pattern 3C.The fourth positive electrode 31D and the fourth negative electrode 32Dare suitably referred to in combination as a fourth electrode pattern3D. The fifth positive electrode 31E and the fifth negative electrode32E are suitably referred to in combination as a fifth electrode pattern3E. The sixth positive electrode 31F and the sixth negative electrode32F are suitably referred to in combination as a sixth electrode pattern3F. The seventh positive electrode 31G and the seventh negativeelectrode 32G are suitably referred to in combination as a seventhelectrode pattern 3G. The eighth positive electrode 31H and the eighthnegative electrode 32H are suitably referred to in combination as aneighth electrode pattern 3H. The ninth positive electrode 31I and theninth negative electrode 32I are suitably referred to in combination asa ninth electrode pattern 3I.

In the present embodiment, each electrode member 3 has a shape which iselongated in the X axial direction. The shape within the XY plane of theedge of each electrode member 3 that faces the edge of the holdingmember 20 is a curved shape that corresponds to the outer shape of theholding surface 19. Moreover, the shape within the XY plane of the edgesof the respective positive electrodes 31 that face the negativeelectrodes 32 is a straight line which is substantially parallel withthe Y axis, while the shape within the XY plane of the edges of therespective negative electrodes 32 that face the positive electrodes 31is a straight line which is substantially parallel with the Y axis.

Moreover, the shape within the XY plane of the edges on the +Y side andof the edges on the −Y side of each positive electrode 31B to 31H (i.e.,excluding the first and ninth positive electrodes 31A and 31H) arestraight lines which are substantially parallel with the X axis. Inaddition, the size of each positive electrode 31 in the Y axialdirection is substantially the same. The shape within the XY plane ofthe edge on the +Y side of the first positive electrode 31A is astraight line which is substantially parallel with the X axis, while theshape within the XY plane of the edge on the −Y side of the ninthpositive electrode 31I is a straight line which is substantiallyparallel with the X axis.

Moreover, the shape within the XY plane of the edges on the +Y side andof the edges on the −Y side of each negative electrode 32B to 32H (i.e.,excluding the first and ninth negative electrodes 32A and 32H) arestraight lines which are substantially parallel with the X axis. Inaddition, the size of each negative electrode 32 in the Y axialdirection is substantially the same. The shape within the XY plane ofthe edge on the +Y side of the first negative electrode 32A is astraight line which is substantially parallel with the X axis, while theshape within the XY plane of the edge on the −Y side of the ninthnegative electrode 32I is a straight line which is substantiallyparallel with the X axis.

In addition, in the present embodiment, the plurality of electrodemembers 3 that include the respective positive electrodes 31 andnegative electrodes 32 are positioned so as to match substantially theentire area of the holding surface 19.

As is shown in FIG. 3, the substrate stage 2 is provided with a powersupply device 22 which is capable of supplying a predetermined voltageto the plurality of electrode members 3. The power supply device 22 isprovided with wires 23 that are connected to the respective electrodemembers 3, a voltage generator 24 that generates voltage to be suppliedto the respective electrode members 3 via the wires 23, switches 25 thatare located on the wires 23 and that switch between supplying voltageand stopping the supply of voltage to the electrode members 3, and avoltage regulator 26 that is capable of regulating the value of thevoltage supplied to the respective electrode members 3. A plurality ofthe switches 25 are provided so as to correspond to the plurality ofelectrode members 3 (i.e., the electrode patterns 3A to 3I). The voltageregulator 26 is able to individually regulate the value of each voltagethat is supplied to each one of the plurality of electrode members 3.The power supply device 22 is controlled by the control unit 5. Notethat if the voltage values are not regulated, then it is not necessaryto supply the voltage regulator 26.

The control unit 5 generates Coulomb force and/or Johnsen-Rahbek forcebetween the holding surface 19 of the holding member 20 and a rearsurface of the substrate P by supplying a predetermined voltage to thepositive electrode 31 and negative electrode 32 of the electrostaticchuck mechanism. As a result, the substrate P attracts to the holdingsurface 19 of the holding member 20 by electrostatic force and is heldthereon.

FIG. 4 is a side cross-sectional view of the holding member 20. In FIG.2 and FIG. 4, the substrate stage 2 is provided with a moving mechanism44 that moves the substrate P relative to the holding member 20. Themoving mechanism 44 moves the substrate P relative to the holdingsurface 19 of the holding member 20 mainly in the Z axial direction. Ifthe moving mechanism 44 is provided, for example, on a coarse movementstage (not shown), then it is possible to lighten the weight of the finemovement stage (not shown) and the holding member 20. As a result, it ispossible to improve the accuracy which with the substrate P ispositioned. In the present embodiment, the movement mechanism 44 isplaced on the coarse movement stage, however, it can also be provided inanother location such as on the fine movement stage or the holdingmember 20.

The moving mechanism 44 is provided with a plurality of supportingmembers 41A, 41B, and 41C that respectively have supporting surfaces40A, 40B, and 40C that are capable of supporting the rear surface of thesubstrate P, and with drive apparatuses 45 that are capable of movingthe respective supporting members 41A, 41B, and 41C in a direction whichis perpendicular to the holding surface 19 (i.e., the Z axialdirection). Each supporting member 41A, 41B, and 41C is a rod shapedcomponent. In the present embodiment, the first supporting member 41Aand the second supporting member 41B have substantially the samestructure, while the third supporting member 41C has a differentstructure from that of the first and second supporting members 41A and41B.

The holding member 20 has a plurality of holes 43A, 43B, and 43C thatare formed such that they extend the interior of the holding member 20in the Z axial direction correspondingly to the supporting members 41A,41B, and 41C. In the present embodiment, at least a portion of eachsupporting member 41A, 41B, and 41C is placed in the respective holes43A, 43B, and 43C, however, normally, it is not necessary for therespective supporting members 41A, 41B, and 41C to be placed inside theholes 43A, 43B, and 43C. For example, it is also possible to employ astructure in which the respective supporting members 41A, 41B, and 41Cpass through the holes 43A, 43B, and 43C and thereby push up thesubstrate P only when the substrate P needs to be pushed up in the Zaxial direction. In the present embodiment, top ends of the holes 43A,43B, and 43C are placed at substantially equal intervals so as toencircle the center of the holding surface 19.

The supporting members 41A, 41B, and 41C are capable of moving in the Zaxial direction through the holes 43A, 43B, and 43C. The driveapparatuses 45 are able to move each supporting member 41A, 41B, and 41Cindependently. The moving mechanism 44 is able to move the supportingmembers 41A, 41B, and 41C using the drive apparatuses 45 such that thesupporting surfaces 40A, 40B, and 40C of the supporting members 41A,41B, and 41C are located on the +Z side of the holding surface 19. Inaddition, the moving mechanism 44 is able to move the supporting members41A, 41B, and 41C using the drive apparatuses 45 such that thesupporting surfaces 40A, 40B, and 40C of the supporting members 41A,41B, and 41C are located on the −Z side of the holding surface 19.Various types of actuator such as electromagnetic actuators andactuators that use piezoelectric elements can be used for the driveapparatuses 45.

The supporting members 41A, 41B, and 41C are capable of moving relativeto the holding surface 19 of the holding member 20 by means of the driveapparatuses 45 while supporting predetermined areas of the rear surfaceof the substrate P which is facing the holding surface 19. Namely, whenthe substrate P is supported on the supporting surfaces 40A, 40B, and40C of the supporting members 41A, 41B, and 41C, the moving mechanism 44is able to move the substrate P in a direction in which the holdingsurface 19 of the holding member 20 and the rear surface of thesubstrate P move towards each other or move away from each other bymoving the supporting members 41A, 41B, and 41C by means of the driveapparatuses 45.

In the present embodiment, the first and second supporting members 41Aand 41B include an electrostatic chuck mechanism, and the supportingsurfaces 40A and 40B are able to hold the rear surface of the substrateP by means of electrostatic force. As is shown in FIG. 4, the substratestage 2 is provided with a plurality of electrode members 46 that areprovided on the first and second supporting members 41A and 41B, andthat generate electrostatic force that attracts the substrate P to thesupporting surfaces 40A and 40B, and with a power supply device 22B thatis capable of supplying voltage to the plurality of electrode members46. Note that it is also possible to not provide the power supply device22B on the substrate stage, and to instead place it in another positioninside the vacuum chamber 6 or in another position outside the vacuumchamber 6.

FIG. 5 is a plan view showing an electrode member 46 provided in thefirst supporting member 41A. The electrode member 56 is placed insidethe first supporting member 41A. The electrostatic chuck mechanism ofthe present embodiment is what is known as a bipolar system, andincludes electrode members 46A to which a positive potential is appliedby the power supply device 22B and electrode members 46B to which anegative potential is applied by the power supply device 22B. In thedescription below, the electrode members 46 to which a positivepotential is applied are suitably referred to as positive electrodes46A, while the electrode members 46 to which a negative potential isapplied are suitably referred to as negative electrodes 46B.

As is shown in FIG. 4, the power supply device 22B is provided withwires 23B that are connected to the respective electrode members 46, avoltage generator 24B that generates voltage to be supplied to therespective electrode members 46 via the wires 23B, switches 25B that arelocated on the wires 23B and that switch between supplying voltage andstopping the supply of voltage to the electrode members 46, and avoltage regulator 26B that is able to regulate the value of the voltagesupplied to the respective electrode members 46. Note that for reasonsof convenience in the description below, only one wire 23B and switch25B are described, however, a wire 23B and switch 25B are provided foreach one of the electrode members 46.

The control unit 5 generates Coulomb force and/or Johnsen-Rahbek forcebetween the supporting surface 40A and a rear surface of the substrate Pby supplying a predetermined voltage to the positive electrodes 46A andnegative electrodes 46B of the electrostatic chuck mechanism. As aresult, the substrate P becomes attracted to the supporting surface 40Aof the first supporting member 41A by electrostatic force and is heldthereon.

In the same way, the second supporting member 41B has an electrostaticchuck mechanism which includes positive electrodes 46A and negativeelectrodes 46B in the same way as the first supporting member 41A, andpredetermined voltage is supplied to the positive electrodes 46A andnegative electrodes 46B by the power supply device 22B. The structure ofthe second supporting member 41B is substantially the same as thestructure of the first supporting member 41A and a description of thesecond supporting member 41B is therefore omitted.

Note that, in the present embodiment, both positive electrodes andnegative electrodes are placed in each of the supporting members 41A and41B, however, it is also possible for only one electrode to be placed ineach of the supporting members 41A and 41B such as, for example, placinga positive electrode on the supporting member 41A side and a negativeelectrode on the supporting member 41B side. Moreover, the number ofsupporting members 41 is not limited to two, and one supporting member41 or three or more supporting members 41 may be provided.

Moreover, in the present embodiment, the substrate stage 2 is alsoprovided with an antistatic device 47 that removes electrostatic chargeon the substrate P held on the holding member 20. In the presentembodiment, the antistatic device 47 includes a third supporting member41C of the moving mechanism 44.

The third supporting member 41C of the present embodiment includes aconductive member 48 which has conductivity. In the present embodiment,the conductive member 48 is formed at least on a supporting surface 40Cof the third supporting member 41C. Moreover, as is shown in FIG. 4, theconductive member 48 of the third supporting member 41C is grounded(i.e. is earthed). As a result of the grounded conductive member 48coming into contact with the substrate P, electricity (i.e., anyelectric charge) which is electrifying the substrate P is removed fromthat substrate P.

As is shown in FIG. 2, in the present embodiment, an aperture 42Cthrough which the third supporting member 41C is able to move ispositioned on the −Y side (i.e., on the first electrode pattern 3A side)of the center of the holding surface 19. Apertures 42A and 42B throughwhich the first and second supporting members 41A and 41B are able tomove are positioned on the +Y side (i.e., on the ninth electrode pattern3I side) of the center of the holding surface 19.

FIG. 6 is a typical view showing a relationship between shot areas S onthe substrate P on which a pattern has been formed by the irradiation ofexposure light EL, and the holding member 20. Note that in FIG. 6 thesupporting members 41A, 41B, and 41C and the like have been omitted fromthe drawing. As is shown in FIG. 6, shot areas S which are exposuresubject areas are set on the substrate P. The mask M has a patternformation area MR (see FIG. 1) on which a pattern that is to beprojected onto the shot areas S is placed. In the present embodiment, animage of the pattern that is placed on the pattern formation area MR ofthe mask M is projected onto a single shot area S. Namely, a pattern isformed on a single shot area S in accordance with the pattern that isplaced on the pattern formation area MR of the mask M. For example, whena pattern for one chip (i.e., a device pattern) is formed on the patternformation area MR of the mask M, the pattern for one chip is formed on asingle shot area S. When a pattern (i.e., a device pattern) for aplurality of chips (for example, for two chips) is formed on the patternformation area MR of the mask M, a pattern for the plurality of chips isformed on the single shot area S.

Exposure light EL is irradiated from the pattern within the illuminationarea IR of the mask M onto the projection area PR of the projectionoptical system PL. As is shown in FIG. 6, in the present embodiment, theprojection area PR is a rectangular shape (i.e., slit shape) which iselongated in the X axial direction. The projection optical system PLirradiates the projection area PR with the exposure light from thepattern on the mask M which corresponds to the illumination area IR, andexposes a portion of the shot areas S on the substrate P with theirradiated exposure light onto the projection area PR.

When a single shot area S is being exposed, the control unit 5irradiates the exposure light EL onto the projection area PR whilemoving the shot area S on the substrate P in the Y axial directionrelative to the projection area PR in synchronization with the movementin the Y axial direction of the pattern formation area MR on the mask Mrelative to the illumination area IR. As a result, an image of thepattern placed on the pattern formation area MR on the mask M isprojected onto the shot area S.

A plurality of shot areas S are set in a matrix layout on the substrateP, and this plurality of shot areas S are exposed in sequence. Namely,the pattern that is placed on the pattern formation area MR of the maskM is formed in sequence on each of the plurality of shot areas S on thesubstrate P. The control unit 5 sequentially exposes the plurality ofshot areas S while repeatedly performing an operation to irradiate theexposure light EL onto the substrate P while moving the mask M and thesubstrate P in synchronization in the Y axial direction in order toexpose a predetermined shot area S, and an operation to move thesubstrate P in a stepping motion in the X axial direction in order toexpose the next shot area S. In the present embodiment, as an example,the control unit 5 sequentially exposes the plurality of shot areas S onthe substrate P while moving the substrate stage 2 such that theprojection area PR of the projection optical system PL and the substrateP are moved relatively following the arrow R1 shown in FIG. 6.

As is shown in FIG. 6, in the present embodiment, nine shot area groups,which are made up of a plurality of shot areas S aligned in the X axialdirection, are aligned in the Y axial direction on the substrate P.

In the description given below, of the plurality of shot area groupsthat are aligned in the Y axial direction, the shot area group that isclosest to the edge on the −Y side of the holding surface 19 is called afirst shot area group S1 when appropriate, the shot area group that isnext closest to the edge on the −Y side of the holding surface 19 afterthe first shot area group S1 is called a second shot area group S2 whenappropriate. In addition, of the plurality of shot area groups, thethird, fourth, etc. up to the eighth shot area group in sequence in the+Y direction from the second shot area group S2 are referred to as athird shot area group S3, a fourth shot area group S4, . . . , up to aneighth shot area group S8, while the shot area group that is closest tothe edge on the +Y side of the holding surface 19 is referred to as aninth shot area group S9 when appropriate.

As is shown in FIG. 6, in the present embodiment, each of the electrodemembers 3 has a size and shape that corresponds to the patterninformation, and is positioned on the holding member 20 in accordancewith the pattern information. The pattern information includes at leastone of information relating to the size of the pattern and patternlayout information. In the present embodiment, the pattern informationincludes information about the pattern formed on the substrate P.

Information relating to the size of the pattern includes informationrelating to the size of the pattern formed on the substrate P, andincludes information relating to the size of the pattern that is formedon the substrate P as a result of an image of the pattern which isplaced on the pattern formation area MR of the mask M being projectedthereon. Namely, in the present embodiment, information relating to thesize of the pattern includes information relating to the size of theshot areas S on the substrate P, and consequently information relatingto the size of the chips that are to be formed on the substrate P.

The pattern layout information includes layout information for thepattern that is formed on the substrate P, and includes informationrelating to the layout of the pattern that is formed on the substrate Pas a result of an image of the pattern which is placed on the patternformation area MR of the mask M being projected thereon. Namely, in thepresent embodiment, information relating to the layout of the patternincludes information relating to the layout of the plurality of shotareas S on the substrate P, and consequently information relating to thelayout of the chips that are formed on the substrate P.

In the present embodiment, the plurality of electrode members 3 arearranged in accordance with information relating to the pattern that isformed on the substrate P, specifically, in accordance with informationrelating to the shot areas S that are set on the substrate P. As isshown in FIG. 6, in the present embodiment, the size in the Y axialdirection of the respective electrode members 3 is set so as tosubstantially match the size in the Y axial direction of the shot areasS. When a single chip is to be formed on a single shot area S, the sizein the Y axial direction of each electrode member 3 is set so as tosubstantially match the size in the Y axial direction of a single chip.Moreover, the sizes in the X axial direction of each of the firstthrough ninth electrode patterns 3A to 3I that are formed by theelectrode members 3 are set so as to substantially match the sizes inthe X axial direction of each of the first through ninth shot areagroups S1 to S9 that are formed by the shot areas S.

Moreover, each electrode member 3 is arranged so as to correspond to theplurality of shot areas S. In the present embodiment, each of the firstthrough ninth electrode patterns 3A to 3I is arranged so as tocorrespond respectively to each of the first through ninth shot areagroups S1 to S9.

As an example, the diameters of the circular substrate P and the holdingsurface 19 which is substantially the same as the outer configuration ofthis substrate P are 300 mm, the size in the Y axial direction of eachelectrode member 3 (i.e., the size in the Y axial direction of a singlechip) is approximately 33 mm, and the distance between adjacentelectrode members 3 is approximately 5 mm.

Next, an example of a method of exposing a substrate P using theexposure apparatus EX having the above described structure will bedescribed.

In the present embodiment, the power supply device 22 regulates thevoltage that is supplied to each electrode member 3 in accordance withpattern information. As is described above, pattern information includesat least one of information relating to the size of the pattern that isformed on the substrate P, and pattern layout information, and includesinformation relating to the shot areas S on the substrate P, andinformation on the chips that are to be formed on the substrate P.

Moreover, in the present embodiment, the pattern information includesthe pattern formation sequence. The sequence in which the pattern is tobe formed includes the sequence in which the pattern is to be formed onthe substrate P. In the present embodiment, the sequence in which thepattern is to be formed on the substrate P includes the sequence inwhich the operation to form patterns on each of the plurality of shotareas S that are set on the substrate P is to be executed, in otherwords, the sequence in which the exposure light EL is irradiated fromthe pattern of the mask M in order to form a pattern on each of the shotareas S.

At a predetermined timing prior to the commencement of the exposure ofthe substrate P, exposure conditions which include pattern information(i.e., pattern formation conditions) are input into the control unit 5by means of the input device 7. Based on the exposure conditionsincluding the pattern information that has been input by means of theinput device 7, the control unit 5 controls at the least the operationof the power supply device 22 when the substrate P is being exposed. Thecontrol unit 5 controls the power supply device 22 in accordance withthe pattern information input by means of the input device 7, andregulates the voltage supplied to each electrode member 3 by this powersupply device 22. Note that the exposure conditions including thepattern information (i.e., the pattern formation conditions) may bestored in advance in the storage device 8. In this case, the controlunit 5 controls the power supply device 22 in accordance with patterninformation that is stored in this storage device 8, so as to enable thevoltage that is supplied to each electrode member 3 to be regulated bythis power supply device 22.

In the present embodiment, a description is given of when the controlunit 5 firstly exposes the shot areas S of the first shot area group S1,and then sequentially exposes the shot areas S of the second, third, . .. , up to the eighth shot area groups S2, S3, . . . , up to S8, and thenfinally exposes the shot areas S of the ninth shot area group S9.

Firstly, as is shown in FIG. 7A, an unexposed substrate P is transportedto (i.e., loaded onto) the holding member 20 of the substrate stage 2 bya predetermined transporting apparatus 50. When loading the substrate Ponto the holding member 20, the control unit 5 moves the supportingmembers 41A to 41C using the drive apparatuses 45 of the movingmechanism 44 such that the supporting surfaces 40A to 40C of thesupporting members 41A to 41C are located above (i.e., on the +Z side)of the holding surface 19 of the holding member 20. As is shown in FIG.7B, the transporting apparatus 50 loads the substrate P onto thesupporting surfaces 40A to 40C of the supporting members 41A to 41C thatare positioned on the +Z side of the holding surface 19.

In the present embodiment, the first and second supporting members 41Aand 41B have electrostatic chuck mechanisms that include positiveelectrodes 46A and negative electrodes 46B, and a substrate P that hasbeen delivered by the transporting apparatus 50 is held thereon byelectrostatic force. As a result, it is possible to limit any shiftingin the position of the substrate P or the like. After the rear surfaceof the substrate P has been attracted to the supporting surfaces 40A and40B of the first and second supporting members 41A and 41B byelectrostatic force, the control unit 5 moves the supporting members 41Ato 41B that support the rear surface of the substrate P downwards (i.e.,in the −Z direction). Namely, the control unit 5 moves the supportingmembers 41A to 41B that support the rear surface of the substrate P suchthat the rear surface of the substrate P and the holding surface 19 ofthe holding member 20 come closer together. As a result, as is shown inFIG. 7C, the substrate P is placed on the holding surface 19 of theholding member 20. After the substrate P has been placed on the holdingsurface 19 of the holding member 20, the control unit 5 stops the supplyof voltage by the power supply device 22B to the electrode members 46.In addition, the control unit 5 moves the supporting members 41A to 41Bin the −Z direction until the rear surface of the substrate P and thesupporting surfaces 40A to 40B of the supporting members 41A to 41B areseparated. As a result, the holding surface 19 of the holding member 20is placed in a state in which it is capable of holding a substrate P,and the supporting of the substrate P by the supporting members 41A to41C is terminated.

After the substrate P has been placed on the holding surface 19 of theholding member 20 that is provided with the electrode members 3, inorder to attract the substrate P to the holding surface 19 byelectrostatic force, the control unit 5 supplies a predetermined voltageto the electrode members 3 using the power supply device 22. In thepresent embodiment, after the substrate P has been placed on the holdingsurface 19 but prior to the exposure of the substrate P, a predeterminedvoltage is applied to each one of the respective positive electrodes 31Ato 31I and each one of the respective negative electrodes 32A to 32I ofall of the electrode patterns 3A to 3I. As a result, the substrate P isheld by attracting to the holding surface 19 of the holding member 20 byelectrostatic force.

After the substrate P has been held by electrostatic force on theholding surface 19 of the holding member 20, the control unit 5positions the substrate P using an alignment device such as an FIA orthe like, and commences the exposure processing for the substrate P. Aplurality of shot areas S are set on the substrate P, and an operationis executed in which this plurality of shot areas S are sequentiallyexposed, and the pattern that is placed on the pattern formation area MRof the mask M is formed on each one of the shot areas S on the substrateP.

Hereinafter, a description will be given while referring to the typicalviews in FIG. 8 through FIG. 11 of an operation to regulate the voltagessupplied by the power supply device 22 to the plurality of electrodemembers 3 in accordance with the information relating to the patternthat is formed on the substrate P. Specifically, a description of anoperation to select predetermined electrode members 3 among theplurality of electrode members 3 in accordance with the information ofthe pattern being to be formed on the substrate P, and to regulate thevoltage applied to the predetermined electrode members 3. Note that, inFIG. 8 through FIG. 11, the supporting members 41A, 41B, and 41C and thelike have been omitted from the drawings.

In the present embodiment, the power supply device 22 sets at least theabsolute value of the voltage value that is supplied to the positiveelectrodes 31 and the negative electrodes 32 that correspond to the shotareas S on the substrate P where an operation to form a pattern iscurrently underway to a larger value than the absolute value of thevoltage value supplied to the positive electrodes 31 and the negativeelectrodes 32 that correspond to the other shot areas S.

In the present embodiment, the power supply device 22 supplies voltagesof a predetermined value to at least the electrode members 3 thatcorrespond to the shot areas S on the substrate P where an operation toform a pattern is underway, and sets the absolute value of the voltagevalue that is supplied to the electrode members 3 that correspond to atleast a portion of the shot areas S where no operation to form a patternis currently underway to a smaller value than the absolute value of thepredetermined value.

In the present embodiment, the power supply device 22 sets the absolutevalue of the voltage value that is supplied to the positive electrodes31 and the negative electrodes 32 that correspond to the shot areas S onthe substrate P where a pattern has not yet been formed and where anoperation to form a pattern is currently underway to a larger value thanthe absolute value of the voltage value that is supplied to the positiveelectrodes 31 and the negative electrodes 32 that correspond to the shotareas S on the substrate P after a pattern has been formed. In thepresent embodiment, the voltage value that is supplied to the positiveelectrodes 31 and the negative electrodes 32 that correspond to the shotareas S on the substrate P after a pattern has been formed is set to‘OFF’. In order to set the voltage to ‘OFF’ in the present embodiment,the electrode members 3 are grounded by the switches 25, however, it isalso possible to set the value of the voltage supplied from the powersupply to 0. This also applies in the other embodiments.

In the present embodiment, the pattern formation operation includes anoperation to irradiate exposure light EL onto the substrate P from thepattern on the mask M in order to form the pattern on the substrate P.Accordingly, when a pattern formation operation is referred to as being‘currently underway’, this includes a state in which the substrate P iscurrently being irradiated with exposure light EL from the pattern onthe mask M, namely, includes a state in which the substrate P iscurrently being exposed. Moreover, the term ‘where a pattern has not yetbeen formed’ includes a state prior to a pattern formation operationbeing executed, and includes a state prior to the substrate P beingirradiated with exposure light EL from the pattern on the mask M,namely, a state prior to exposure of the substrate P being executed.Moreover, the term ‘after a pattern has been formed’ includes a stateafter a pattern formation operation has been executed, and includes astate after the exposure light EL has been irradiated from the patternon the mask M, namely, a state after exposure has been executed.

In FIG. 8 through FIG. 11, of the plurality of shot areas S, the shotareas S where a pattern formation operation is currently underway andwhere a pattern formation operation has already been executed are shownby a solid line, while the shot areas S where a pattern has not yet beenformed are shown by a broken line. Moreover, the electrode members 3 towhich voltage is being supplied by the power supply device 22 are shownby oblique lines.

Firstly, as is shown in FIG. 8, of the plurality of shot areas S thatare set on the substrate P, exposure of the shot areas S of the firstshot area group S1 is executed. While the pattern formation operationfor the shot areas S of the first shot area group S1 is currentlyunderway, namely, while the shot areas S of the first shot area group S1are being exposed, the power supply device 22 supplies voltage (i.e.,sets the voltage to ON) of a predetermined value to all of the electrodemembers 3 (i.e., the positive electrodes 31 and the negative electrodes32) of the first through ninth electrode patterns 3A to 3I. As a result,in a state in which the substrate P is being properly held by theholding member 20, exposure of the shot areas S of the first shot areagroup S1 is properly executed.

As is shown by the typical view in FIG. 9, when the pattern formationoperation for each shot area S of the first shot area group S1 is ended,and a pattern formation operation for each shot area S of the secondshot area group S2 commences, the power supply device 22 stops (i.e.,sets to OFF) the supply of voltage to the electrode members 3 of thefirst electrode pattern 3A that corresponds to the shot areas S of thefirst shot area group S1 on the substrate P after the pattern has beenformed. Namely, the power supply device 22 grounds the electrode members3 of the first electrode pattern 3A that corresponds to the shot areas Sof the first shot area group S1 on the substrate P after a pattern hasalready been formed thereon (i.e., after the exposure thereof) and wherea pattern formation operation is not currently underway. The powersupply device 22 electrically grounds the electrode members 3 of thefirst electrode pattern 3A using, for example, the switches 25.Moreover, in the present embodiment, the power supply device 22maintains at a predetermined value the voltage value that is beingsupplied by the power supply device 22 to the second through ninthelectrode patterns 3B through 3I that correspond to the shot areas S ofthe second through ninth shot area groups S2 through S9 on the substrateP where a pattern has not yet been formed, and also where a patternformation operation is currently underway. As a result, theelectrostatic force per unit area that is generated between the rearsurface of the substrate P and the area of the portion of the holdingsurface 19 that corresponds to the first electrode pattern 3A can bemade weaker than the electrostatic force per unit area that is generatedbetween the rear surface of the substrate P and the areas of theportions of the holding surface 19 that correspond to the second throughninth electrode patterns 3B through 3I. In addition, because voltage ofa predetermined value is supplied to the second through ninth electrodepatterns 3B through 3I that correspond to the shot areas S on thesubstrate P where a pattern has not yet been formed and also where apattern formation operation is currently underway, in a state in whichthe substrate P is being properly held by the holding member 20,exposure of the shot areas S of the second shot area group S2 isproperly executed. Specifically, even if, for example, the temperatureof the substrate P in those areas that correspond to the second throughninth electrode patterns rises because of the exposure, by securelyholding the substrate P using the holding member 20, it is possible toprevent any shift in the position of the areas of the substrate thathave not yet been exposed. Accordingly, because it is possible to exposeall the shot areas based on alignments that were made prior to theexposure commencing, it is possible to prevent any exposuremalfunctions.

In this manner, by supplying voltage of a predetermined value to thepositive electrodes 31 and the negative electrodes 32 that correspond tothe shot areas S on the substrate P where a pattern has not yet beenformed and also where a pattern formation operation is currentlyunderway, it is possible to generate a predetermined electrostatic forceper unit area between the rear surface of the substrate P and theholding surface 19 that corresponds to these positive electrodes 31 andnegative electrodes 32. Moreover, by supplying voltage of a value thatis smaller (including 0) than the predetermined value to the positiveelectrodes 31 and the negative electrodes 32 that correspond to the shotareas S on the substrate P after a pattern has been formed thereon, itis possible to make the electrostatic force per unit area between therear surface of the substrate P and the holding surface 19 thatcorresponds to these positive electrodes 31 and negative electrodes 32weaker than the former predetermined electrostatic force per unit area.

When the exposure of the plurality of shot areas S is underway and, asis shown in typical view in FIG. 10, the pattern formation operation foreach shot area S of the first through third shot area groups S1 throughS3 has ended, and the pattern formation operation for the shot areas Sof the fourth shot area group S4 has commenced, the power supply device22 stops the supply of voltage to the electrode members 3 of the firstthrough third electrode patterns 3A through 3C that correspond to theshot areas S of the first through third shot area groups S1 through S3on the substrate P after the pattern has been formed thereon. Namely,the power supply device 22 sets to OFF the value of the voltage that issupplied to the electrode members 3 of the first through third electrodepatterns 3A through 3C that correspond to the shot areas S of the firstthrough third shot area groups S1 through S3 on the substrate P after apattern has already been formed thereon (i.e., after the exposurethereof) and where a pattern formation operation is not currentlyunderway. Moreover, in the present embodiment, the power supply device22 maintains at a predetermined value the voltage value that is beingsupplied by the power supply device 22 to the fourth through ninthelectrode patterns 3B through 3I that correspond to the shot areas S ofthe fourth through ninth shot area groups S4 through S9 on the substrateP where a pattern has not yet been formed, and also where a patternformation operation is currently underway. As a result, theelectrostatic force per unit area that is generated between the rearsurface of the substrate P and the areas of the portions of the holdingsurface 19 that correspond to the first through third electrode patternselectrode pattern 3A through 3C can be made weaker than theelectrostatic force per unit area that is generated between the rearsurface of the substrate P and the areas of the portions of the holdingsurface 19 that correspond to the fourth through ninth electrodepatterns 3D through 3I. In addition, because voltage of a predeterminedvalue is supplied to the fourth through ninth electrode patterns 3Dthrough 3I that correspond to the shot areas S on the substrate P wherea pattern has not yet been formed and also where a pattern formationoperation is currently underway, in a state in which the substrate P isbeing properly held by the holding member 20, exposure of the shot areasS of the fourth shot area group S4 is properly executed.

When the exposure of the plurality of shot areas S is underway and, asis shown in typical view in FIG. 11, the pattern formation operation foreach shot area S of the first through eighth shot area groups S1 throughS8 has ended, and the pattern formation operation for the shot areas Sof the ninth shot area group S9 has commenced, the power supply device22 stops the supply of voltage to the electrode members 3 of the firstthrough eighth electrode patterns 3A through 3H that correspond to theshot areas S of the first through eighth shot area groups S1 through S8on the substrate P after the pattern has been formed thereon. Namely,the power supply device 22 sets to OFF the value of the voltage that issupplied to the electrode members 3 of the first through eighthelectrode patterns 3A through 3H that correspond to the shot areas S ofthe first through eighth shot area groups S1 through S8 on the substrateP after a pattern has already been formed thereon (i.e., after theexposure thereof) and where a pattern formation operation is notcurrently underway. Moreover, in the present embodiment, the powersupply device 22 maintains at a predetermined value the voltage valuethat is being supplied by the power supply device 22 to the ninthelectrode pattern 3I that corresponds to the shot areas S of the ninthshot area group S9 on the substrate P where a pattern has not yet beenformed, and also where a pattern formation operation is currentlyunderway. As a result, the electrostatic force per unit area that isgenerated between the rear surface of the substrate P and the areas ofthe portions of the holding surface 19 that correspond to the firstthrough eighth electrode patterns electrode pattern 3A through 3H can bemade weaker than the electrostatic force per unit area that is generatedbetween the rear surface of the substrate P and the area of the portionof the holding surface 19 that corresponds to the ninth electrodepattern 3I. In addition, because voltage of a predetermined value issupplied to the ninth electrode pattern 3I that corresponds to the shotareas S on the substrate P where a pattern has not yet been formed andalso where a pattern formation operation is currently underway, in astate in which the substrate P is being properly held by the holdingmember 20, exposure of the shot areas S of the ninth shot area group S9is properly executed.

In this manner, in the present embodiment, the control unit 5 selectspredetermined electrode members 3 from among the plurality of electrodemembers 3 in accordance with information relating to the pattern that isbeing formed on the substrate P, and supplies predetermined voltage tothese selected electrode members 3.

After a pattern has been formed on all of the shot areas S on thesubstrate P, namely, after exposure of all of the shot areas S hasended, the power supply device 22 stops the supply of voltage to all ofthe plurality of electrode members 3. In addition, the control unit 5starts operations to transport (i.e., unload) the exposed substrate Paway from the holding member 20.

FIG. 12A is a view showing a state of the holding member 20 after apattern has been formed on all of the shot areas S on the substrate P.In order to unload the substrate P from the holding member 20, thecontrol unit 5 moves the supporting members 41A through 41C using thedrive apparatuses 45 of the moving mechanism 44 such that the supportingsurfaces 40A to 40C of the supporting members 41A to 41C is placed above(i.e., in the +Z direction) the holding surface 19 of the holding member20. Namely, after a pattern has been formed on all of the shot areas Son the substrate P, the control unit 5 starts to move the substrate Prelative to the holding member 20 using the moving mechanism 44 suchthat the rear surface of the substrate P and the holding surface 19 ofthe holding member 20 move away from each other. As a result, as isshown in FIG. 12B, the supporting surfaces 40A to 40C of the supportingmembers 41A to 41C are placed above (i.e., in the +Z direction) theholding surface 19, and the rear surface of the substrate P that isbeing supported by the supporting surfaces 40A to 40C of the supportingmembers 41A to 41C and the holding surface 19 of the holding member 20move away from each other in the Z axial direction.

When the rear surface of the substrate P is supported by the supportingmembers 41A to 41C, and the rear surface of the substrate P and theholding surface 19 of the holding member 20 are to be separated fromeach other, the control unit 5 supplies predetermined voltages to thepositive electrodes 46A and the negative electrodes 46B that areprovided on the first and second supporting members 41A and 41B usingthe power supply device 22B in order to attract the substrate P byelectrostatic force to the supporting surface 40A and 40B. Consequently,the rear surface of the substrate P is held by attracting byelectrostatic force to the supporting surfaces 40A and 40B of the firstand second supporting members 41A and 41B. When the supporting surfaces40A and 40B and the substrate P are attracted together by electrostaticforce, the control unit 5 moves the supporting members 41A through 41Cupwards (i.e., in the +Z direction), and thereby separates the rearsurface of the substrate P from the holding surface 19 of the holdingmember 20. As a result, it is possible to limit any shifting in theposition of the substrate P or the like.

Moreover, in the present embodiment, the third supporting member 41Cincludes the grounded conductive member 48 and is in contact with therear surface of the substrate P when the holding surface 19 of theholding member 20 separates from the rear surface of the substrate P. Asa result of the third supporting member 41C that includes the conductivemember 48 coming into contact with the substrate P, electricity (i.e.,an electric charge) that is electrifying the substrate P can be removed.In this manner, when the holding member 20 is separated from thesubstrate P, the antistatic device 47 that includes the conductivemember 48 of the third supporting member 41C is able to removeelectrostatic charge on the substrate P using the third supportingmember 41C (i.e., the conductive member 48).

In addition, as is shown in FIG. 12C, the exposed substrate P istransported away (i.e., unloaded) from the holding member 20 of thesubstrate stage 2 by a predetermined transporting apparatus 50. When thesubstrate P that is being supported on the supporting members 41A to 41Cis transferred to the transporting apparatus 50, the control unit 5stops the supply of voltage to the electrode members 46 by the powersupply device 22B. Consequently, the hold by the electrostatic chuckmechanisms of the first and second supporting members 41A and 41B isreleased, and the substrate P is smoothly transported away by thetransporting apparatus 50. Moreover, when the surface areas of thesupporting surfaces 40A and 40B are sufficiently small, and the supplyof voltage to the electrode members 46 by the power supply device 22Bhas been stopped, even if residual electrostatic force (i.e., adhesiveforce) is generated, this residual electrostatic force is satisfactorilysmall. Accordingly, the rear surface of the substrate P can be smoothlyseparated from the supporting surfaces 40A and 40B.

In an electrostatic chuck mechanism, even when the supply of voltage tothe electrode members 3 has been stopped, there is a possibility that,immediately after the supply of voltage to the electrode members 3 hasbeen stopped, it will be difficult to smoothly separate the substrate Pfrom the holding surface 19 due, for example, to residual electrostaticforce. When the residual electrostatic force gradually reduces overtime, in order to separate (i.e., in order to unload) the substrate Psmoothly from the holding surface 19, within a range that still enablesthe hold of the substrate P to be smoothly maintained, it is desirableto stop the supply of voltage to the electrode members 3 at the earliestpossible timing, and lengthen the period between the point when thesupply of voltage to the electrode members 3 is stopped and the pointwhen the operation to separate the holding surface 19 and the substrateP (i.e., the unloading operation) is executed.

In the present embodiment, because a plurality of electrode members 3are provided in accordance with information relating to the patternbeing formed on the substrate P, and the stopping of the voltage to theplurality of electrode members 3 is executed in a predetermined sequencein accordance with this pattern information, it is possible, forexample, to sufficiently reduce the electrostatic force that is residualbased on the electrode members 3 of the first electrode pattern 3A towhich the supply of voltage is first stopped by the time the operationto separate the substrate P from the holding surface 19 is executed(i.e., until the substrate P is unloaded). In the same way, it is alsopossible to sufficiently reduce the electrostatic force that is residualbased on the electrode members 3 of the second, third, . . . , and up tothe eighth electrode patterns 3B, 3C, . . . , and 31I by the time thesubstrate P is unloaded from the holding surface 19. Moreover, if theelectrostatic force that is residual based on the electrode members 3 ofthe ninth electrode pattern 3I is sufficiently reduced by the time theoperation to unload the substrate P from the holding surface 19 isexecuted, then the unloading of the substrate P from the holding member20 can be smoothly executed. Furthermore, even if the electrostaticforce that is residual based on the electrode members 3 of the ninthelectrode pattern 3I is not sufficiently reduced by the time thesubstrate P is unloaded from the holding surface 19, the area of theholding surface 19 that corresponds to the ninth electrode pattern 3I issmall so that the size of the electrostatic force is sufficiently smallwithin a range that allows the hold of the substrate P to be properlyexecuted. Consequently, the unloading of the substrate P from theholding member 20 can be smoothly executed.

In the present embodiment, the values of the voltages that are suppliedto each electrode member 3 are optimized in advance such that the holdof the substrate P can be properly executed in accordance with theweight of the substrate P, the coefficient of friction between theholding surface 19 of the holding member 20 and the rear surface of thesubstrate P, and the rate of acceleration when the substrate stage 2 isbeing moved, and the like. Because of this, when the shot areas S of theninth shot area group S9 are being exposed, by supplying a predeterminedvoltage only to the positive electrodes 31I and the negative electrodes321 of the ninth electrode pattern 3I, the hold of the substrate P canbe suitably maintained by means of the electrostatic force that isgenerated based on this ninth electrode pattern 3I. Moreover, theunloading of the substrate P from the holding member 20 can be smoothlyexecuted.

FIG. 13 is a typical view showing an example of an operation when theholding member 20 and the substrate P are separated by the movingmechanism 44 that includes the supporting members 41A to 41C. As isshown in FIG. 13, the moving mechanism 44 starts to move the substrate Prelative to the holding member 20 such that a portion of the rearsurface of the substrate P moves away from the holding surface 19 beforeother portions thereof. In the present embodiment, the third supportingmember 41C which includes the conductive member 48 supports the portionof the rear surface of the substrate P that moves away first from theholding surface 19. In other words, the drive apparatuses 45 of themoving mechanism 44 are controlled such that, of the three supportingmembers 41A to 41C, the supporting surface 40C of the third supportingmember 41C starts to move in the +Z direction from the holding surface19 earlier than the supporting surfaces 40A and 40B of the othersupporting members 41A and 41B.

As is described above, in the present embodiment, after voltages hasbeen supplied to each of the electrode members 3 of the plurality ofelectrode patterns 3A to 3I so as to cause the substrate P to beattracted to the holding surface 19, the stopping of the supplying ofthe voltages to the plurality of electrode members 3 is executed in apredetermined sequence in accordance with the sequence in which thepatterns are formed (i.e., the sequence in which the shot areas S areexposed). Namely, as was described with reference to FIG. 9 and thelike, firstly, the supplying of voltage to the electrode members 3 ofthe first electrode pattern 3A is stopped, and thereafter the supplyingof voltages to the electrode members 3 is stopped in the sequence of thesecond, the third, . . . , and up to the ninth electrode patterns 3B,3C, . . . , 3I. The moving mechanism 44 starts the movement of thesubstrate P relative to the holding member 20 such that the portion ofthe rear surface of the substrate P that corresponds to the electrodemembers 3 of the first electrode pattern 3A to which the supplying ofvoltage was stopped first, namely, the portion adjacent to the edge ofthe substrate P on the −Y side moves away first from the holding surface19 of the holding member 20.

In the present embodiment, of the plurality of supporting members 41A to41C, the third supporting member 41C which includes the conductivemember 48 is placed adjacent to the edge of the substrate P on the −Yside. The control unit 5 controls the drive apparatuses 45 of the movingmechanism 44 such that the supporting surface 40C of the thirdsupporting member 41C starts to move in the +Z direction from theholding surface 19 earlier than the supporting surfaces 40A and 40B ofthe other supporting members 41A and 41B. As a result, the substrate Pcan be moved such that the portion in the vicinity of the edge on the −Yside of the substrate P that is supported by the supporting surface 40Cof the third supporting member 41C moves away first from the holdingsurface 19 of the holding member 20.

By executing the operation to move the holding surface 19 and the rearsurface of the substrate P away from each other such that the portion ofthe substrate P that corresponds to the first electrode pattern 3A towhich the supply of voltage was stopped first moves away from theholding surface 19 before the other portions of the substrate P, theoperation to move the holding surface 19 and the rear surface of thesubstrate P away from each other can be smoothly executed. After thesupply of voltage to the electrode members 3 has been stopped, even ifresidual electrostatic force is still present, there is a strongpossibility that the electrostatic force that is residual based on theelectrode members 3 of the first electrode pattern 3A to which thesupply of voltage was stopped first will be sufficiently reduced by thetime the substrate P is unloaded from the holding surface 19. Because ofthis, by moving the substrate P such that the portion of the rearsurface of the substrate P where there is a strong possibility that theresidual electrostatic force will be sufficiently reduced moves awayfrom the holding surface 19 before the other portions of the substrateP, it is possibly to smoothly separate the substrate P and the holdingsurface 19.

As has been described above, according to the present embodiment,because the electrode members 3 are arranged in accordance withinformation relating to the pattern that is to be formed on thesubstrate P, and because the power supply device 22 regulates thevoltage that is supplied to the respective electrode members 3 inaccordance with this information relating to the pattern that is to beformed on the substrate P, an operation to transport (i.e., unload) thesubstrate P away can be executed rapidly at the same time as theoperation to hold the substrate P is being properly executed.Accordingly, in a state in which the substrate P is being properly held,the operation to form a pattern on the substrate P can be properlyexecuted, and it is possible to manufacture a device which has a desiredperformance. Moreover, throughput can be improved and this cancontribute to an improvement in device productivity.

Moreover, according to the present embodiment, because an electrostaticchuck mechanism which includes the electrode members 46 is provided inthe supporting members 41A and 41B, the substrate P can be properlysupported using these supporting members 41A and 41B. Accordingly, usingthese supporting members 41A and 41B, it is possible to prevent anyshift in the position of the substrate P, and the operation to transportthe substrate P onto the holding member 20 and the operation totransport the substrate P away from the holding member 20 can beproperly executed. Accordingly, it is possible to prevent anydeterioration in the device performance and contribute to an improvementin device productivity.

Moreover, according to the present embodiment, when the holding memberand the substrate P are separated from each other, because electrostaticcharge on the substrate P is removed by the third supporting member 41Cof the antistatic device 47 (i.e., the conductive member 48), it ispossible to prevent the occurrence of a phenomenon in which it becomesdifficult to separate the holding member 20 and the substrate P becauseof residual electrostatic force. It is thus possible to prevent anylarge load from acting on the substrate P, and the holding member 20 andthe substrate P can be smoothly separated from each other.

Note that, in the present embodiment, when, for example, voltage of apredetermined value is supplied to the electrode members 3 thatcorrespond to the shot areas S of the first shot area group S1 where apattern formation operation is currently underway, and when, once thepattern formation operation for the shot areas S of this first shot areagroup S1 has been completed, a pattern formation operation for the shotareas S for the subsequent second shot area group S2 is starting, thevalue of the voltage that is supplied to the electrode members 3 thatcorrespond to the first shot area group S1 is set to OFF, however, thetiming at which the value of the voltage that is supplied to theelectrode members 3 that correspond to the first shot area group S1 isset to OFF can be set to any desired timing provided that it is afterthe operation to form a pattern on the shot areas S of the first shotarea group S1 has been executed. For example, the value of the voltagethat is supplied to the electrode members 3 that correspond to the firstshot area group S1 can also be set to OFF after the operation to form apattern on the shot areas S of the first shot area group S1 has beenexecuted, and after an operation to form a pattern on the shot areas Sof the subsequent second shot area group S2 has also been executed.

Note also that, in the present embodiment, voltage of a predeterminedpolarity is supplied to the electrode members 3 that correspond to theshot areas S where a pattern formation operation is currently underway,and, once the operation to form a pattern on these shot areas S has beenexecuted, the value of the voltage that is supplied to the electrodemembers 3 that correspond to these shot areas S after this patternformation operation has been executed is set to OFF, however, forexample, it is also possible to apply a voltage of the reverse polarityfor a predetermined time prior to setting this voltage value to OFF. Forexample, in FIG. 9, when the pattern formation operation for each shotarea S of the first shot area group S1 has ended, and the patternformation operation for the shot areas S of the second shot area groupS2 is starting, the value of the voltage that is supplied, for example,to those electrode members 3 to which a positive potential had beensupplied until that point (i.e., the positive electrodes 31A) can bechanged to a negative potential for a predetermined time. By employingthis method, it is possible to prevent the occurrence of residualelectrostatic force (i.e., adhesive force). In the same way, the valueof the voltage that is supplied to those electrode members 3 to which anegative potential had been supplied until that point (i.e., thenegative electrodes 32A) can be changed to a positive potential for apredetermined time. After this, the voltage for the electrode members 3can be set to OFF.

Moreover, in the present embodiment, all the voltage is set to OFF forelectrodes that correspond to areas where exposure has finished,however, it is also possible to not set the voltage to OFF until all theexposure has ended for the electrodes that correspond to a portion ofthe shot areas, for example, the shot areas S7, S8, and S9, and set thevoltage to OFF at the point when exposure of only the electrodes thatcorrespond to the shot areas S1 to S6 has ended.

Second Embodiment

Next, a description will be given of a second embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiment are given the samesymbols and any description thereof is simplified or omitted.

In the above described first embodiment, the value of the voltage thatis supplied to the electrode members 3 that correspond to the shot areasS after a pattern formation operation has been executed is set to OFF,however, the characteristic portion of the second embodiment lies in thefact that the voltage value is not set to OFF, but instead the absolutevalue of the supplied voltage value is minimized.

FIG. 14, FIG. 15, and FIG. 16 are typical views used to illustrate anexample of an operation of the power supply device 22 according to thesecond embodiment. In the same way as in the above described firstembodiment, in the second embodiment as well, patterns are formedsequentially on a plurality of shot areas S on a substrate P. In thepresent embodiment, the power supply device 22 sets the value of thevoltage that is supplied to the electrode members 3 that correspond tothe shot areas S on a substrate P where a pattern has not yet beenformed or where a pattern formation operation is currently under way toa first voltage value, and sets the value of the voltage that issupplied to the electrode members 3 that correspond to the shot areas Swhere a pattern formation operation has already been executed and whereno pattern formation operation is currently being performed to a secondvoltage value that is smaller than the first voltage value. Note thatthe first voltage value and second voltage value are absolute values.

For example, when a pattern formation operation is currently beingperformed on the shot areas S of the first shot area group S1, namely,when exposure of the shot areas S of the first shot area group S1 isbeing performed, the power supply device 22 supplies voltage of thefirst predetermined value to all of the electrode members 3 (i.e., thepositive electrodes 31 and the negative electrodes 32) of the firstthrough ninth electrode patterns 3A through 3I. As a result, thesubstrate P is attracted to the holding surface 19 by electrostaticforce and is held thereon.

In addition, as is shown, for example, in typical view in FIG. 14, whenthe pattern formation operation for each shot area S of the first shotarea group S1 has ended, and a pattern formation operation for the shotareas S of the second shot area group S2 is starting, the power supplydevice 22 sets the value of the voltage that is supplied to theelectrode members 3 of the first electrode pattern 3A, which correspondsto the shot areas S of the first shot area group S1 on the substrate Pwhere a pattern has already been formed, to the second voltage valuewhich is smaller than the first voltage value. The power supply device22 sets the value of the voltage that is supplied to the electrodemembers 3 of the first electrode pattern 3A to the second voltage valueusing, for example, the voltage regulator 26. Moreover, in the presentembodiment, the power supply device 22 maintains the value of thevoltage that is being supplied via the power supply device 22 to thesecond through ninth electrode patterns 3B through 3I, which correspondto the shot areas S of the second through ninth shot area groups S2through S9 on the substrate P where a pattern has not yet been formed orwhere a pattern formation operation is currently underway, at the firstvoltage value.

When the exposure of the plurality of shot areas S is underway and, asis shown in typical view in FIG. 15, the pattern formation operation foreach shot area S of the first through third shot area groups S1 throughS3 has ended, and a pattern formation operation for the shot areas S ofthe fourth shot area group S4 is starting, the power supply device 22sets the value of the voltage that is supplied to the electrode members3 of the first through third electrode patterns 3A through 3C, whichcorrespond to the shot areas S of the first through third shot areagroups S1 through S3 on the substrate P where a pattern has already beenformed, to the second voltage value which is smaller than the firstvoltage value. Moreover, in the present embodiment, the power supplydevice 22 maintains the value of the voltage that is being supplied viathe power supply device 22 to the fourth through ninth electrodepatterns 3B through 3I, which correspond to the shot areas S of thefourth through ninth shot area groups S4 through S9 on the substrate Pwhere a pattern has not yet been formed or where a pattern formationoperation is currently underway, at the first voltage value.

When the exposure of the plurality of shot areas S is underway and, asis shown in the typical view in FIG. 16, the pattern formation operationfor each shot area S of the first through eighth shot area groups S1through S8 has ended, and a pattern formation operation for the shotareas S of the ninth shot area group S9 is starting, the power supplydevice 22 sets the value of the voltage that is supplied to theelectrode members 3 of the first through eighth electrode patterns 3Athrough 3H, which correspond to the shot areas S of the first througheighth shot area groups S1 through S8 on the substrate P where a patternhas already been formed, to the second voltage value which is smallerthan the first voltage value. Moreover, in the present embodiment, thepower supply device 22 maintains the value of the voltage that is beingsupplied via the power supply device 22 to the ninth electrode pattern3I, which corresponds to the shot areas S of the ninth shot area groupS9 on the substrate P where a pattern has not yet been formed or where apattern formation operation is currently underway, at the first voltagevalue.

After a pattern has been formed on all of the shot areas S on thesubstrate P, namely, when exposure of all of the shot areas S has ended,the power supply device 22 stops the supply of voltage to all of theplurality of electrode members 3. The control unit 5 then begins anoperation to transport (i.e., unload) the exposed substrate P away fromthe holding member 20.

In this manner, in the present embodiment, after voltage has beensupplied to the plurality of electrode members 3 and the substrate P hasbeen made to attract to the holding surface 19, the value of the voltagethat is supplied to each of the plurality of electrodes 3 is graduallyreduced in the sequence of the first, second, . . . , and up to theninth electrode patterns 3A, 3B, . . . , 3I. When the holding surface 19and the substrate P are to be separated using the moving mechanism 44after a pattern has been formed on all of the shot areas S on thesubstrate P, the moving mechanism 44 starts moving the substrate Prelative to the holding surface 19 such that the portion of thesubstrate P that corresponds to the electrode members 3 of the firstelectrode pattern 3A where the voltage value was reduced first movesaway first from the holding surface 19.

As has been described above, in the present embodiment as well, becausethe power supply device 22 regulates the voltage that is supplied to therespective electrode members 3 in accordance with the informationrelating to the pattern that is to be formed on the substrate P, anoperation to transport (i.e., unload) the substrate P away can beexecuted rapidly at the same time as the operation to hold the substrateP is being properly executed. Accordingly, in a state in which thesubstrate P is being properly held, the operation to form a pattern onthe substrate P can be properly executed, and it is possible tomanufacture a device which has a desired performance. Moreover,throughput can be improved and this can contribute to an improvement indevice productivity.

Third Embodiment

Next, a description will be given of a third embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiments are given thesame symbols and any description thereof is simplified or omitted.

In the present embodiment, voltage of a predetermined value (i.e., thefirst voltage value) is supplied to the electrode members 3 thatcorrespond to the shot area groups on a substrate P where a pattern hasnot yet been formed or where a pattern formation operation is currentlyunder way, and the value of the voltage that is supplied to theelectrode members 3 that correspond to the shot area groups on thesubstrate P where a pattern has already been formed is set to a valuethat is smaller (i.e., 0 or the second voltage value) than thepredetermined value (i.e., the first voltage value). The characteristicportion of the third embodiment lies in the fact that voltage of apredetermined value is supplied to the electrode members 3 thatcorrespond to the shot area groups on a substrate P where a patternformation operation is currently underway, while the value of thevoltage that is supplied to the electrode members 3 that correspond tothe other shot area groups, namely, those shot area groups where apattern has not yet been formed or where a pattern has already beenformed is set to a value that is smaller than the predetermined value.

FIG. 17, FIG. 18, and FIG. 19 are typical views used to illustrate anexample of an operation of the power supply device 22 according to thethird embodiment. In the same way as in the above described embodiments,in the third embodiment as well, patterns are formed sequentially on aplurality of shot areas S on a substrate P.

As is shown, for example, in typical view in FIG. 17, when a patternformation operation for the shot areas S of the third shot area group S3is started, the power supply device 22 supplies voltage of apredetermined value to (i.e., sets to ON) the electrode members 3 of thethird electrode pattern 3C which corresponds to the shot areas S of thethird shot area group S3 on the substrate P where a pattern formationoperation is currently under way, and sets to OFF the value of thevoltage that is supplied to the electrode members 3 of the first andsecond electrode patterns 3A and 3B which correspond to the shot areas Sof the first and second shot area groups S1 and S2 on the substrate Pwhere a pattern has already been formed, and also sets to OFF the valueof the voltage that is supplied to the electrode members 3 of the fourththrough ninth electrode patterns 3D through 3I which correspond to theshot areas S of the fourth through ninth shot area groups S4 through S9on the substrate P where a pattern has not yet been formed.

As is shown in typical view in FIG. 18, when the pattern formationoperation for each shot area S of the first through third shot areagroups S1 through S3 has ended, and a pattern formation operation forthe shot areas S of the fourth shot area group S4 is starting, the powersupply device 22 supplies voltage of a predetermined value to (i.e.,sets to ON) the electrode members 3 of the fourth electrode pattern 3Dwhich corresponds to the shot areas S of the fourth shot area group S4on the substrate P where a pattern formation operation is currentlyunder way, and sets to OFF the value of the voltage that is supplied tothe electrode members 3 of the first through third electrode patterns 3Athrough 3C which correspond to the shot areas S of the first throughthird shot area groups S1 through S3 on the substrate P where a patternhas already been formed, and also sets to OFF the value of the voltagethat is supplied to the electrode members 3 of the fifth through ninthelectrode patterns 3E through 3I which correspond to the shot areas S ofthe fifth through ninth shot area groups S5 through S9 on the substrateP where a pattern has not yet been formed.

As is shown in typical view in FIG. 19, when the pattern formationoperation for each shot area S of the first through fourth shot areagroups S1 through S4 has ended, and a pattern formation operation forthe shot areas S of the fifth shot area group S5 is starting, the powersupply device 22 supplies voltage of a predetermined value to (i.e.,sets to ON) the electrode members 3 of the fifth electrode pattern 3Ewhich corresponds to the shot areas S of the fifth shot area group S5 onthe substrate P where a pattern formation operation is currentlyunderway, and sets to OFF the value of the voltage that is supplied tothe electrode members 3 of the first through fourth electrode patterns3A through 3D which correspond to the shot areas S of the first throughfourth shot area groups S1 through S43 on the substrate P where apattern has already been formed, and also sets to OFF the value of thevoltage that is supplied to the electrode members 3 of the sixth throughninth electrode patterns 3F through 3I which correspond to the shotareas S of the sixth through ninth shot area groups S6 through S9 on thesubstrate P where a pattern has not yet been formed.

Thereafter, in the same manner, pattern formation operations areexecuted for each shot area S with voltage of a predetermined valuebeing supplied only to the electrode members of the electrode patternswhich correspond to the shot area groups where a pattern formationoperation is currently underway, and with the value of the voltage thatis supplied to the electrode members 3 of electrode patterns whichcorrespond to the other shot area groups being set to OFF.

After a pattern has been formed on all of the shot areas S of thesubstrate P, namely, when exposure of all of the shot areas S has ended,the power supply device 22 stops the supply of voltage to all of theplurality of electrode members 3. The control unit 5 then begins anoperation to transport (i.e., unload) the exposed substrate P away fromthe holding member 20.

In the present embodiment as well, because the power supply device 22regulates the voltage that is supplied to the respective electrodemembers 3 in accordance with the information relating to the patternthat is to be formed on the substrate P, an operation to transport(i.e., unload) the substrate P away can be executed rapidly at the sametime as the operation to hold the substrate P is being properlyexecuted. Accordingly, in a state in which the substrate P is beingproperly held, the operation to form a pattern on the substrate P can beproperly executed, and it is possible to manufacture a device which hasa desired performance. Moreover, throughput can be improved and this cancontribute to an improvement in device productivity.

Fourth Embodiment

Next, a description will be given of a fourth embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiments are given thesame symbols and any description thereof is simplified or omitted.

FIG. 20, FIG. 21, and FIG. 22 are typical views used to illustrate anexample of an operation of the power supply device 22 according to thefourth embodiment. In the same way as in the above describedembodiments, in the fourth embodiment as well, patterns are formedsequentially on a plurality of shot areas S on a substrate P.

For example, when a pattern formation operation has begun for the shotareas S of the third shot area group S3, the power supply device 22 setsthe value of the voltage that is supplied to the electrode members 3 ofthe third electrode pattern 3C, which corresponds to the shot areas S ofthe third shot area group S3 on the substrate P where a patternformation operation is currently underway, to a first voltage value, andsets both the value of the voltage that is supplied to the electrodemembers 3 of the first and second electrode patterns 3A and 3B, whichcorrespond to the shot areas S of the first and second shot area groupsS1 and S2 on the substrate P where a pattern has already been formed,and the value of the voltage that is supplied to the electrode members 3of the fourth through ninth electrode patterns 3D through 3I, whichcorrespond to the shot areas S of the fourth through ninth shot areagroups S4 through S9 on the substrate P where a pattern has not yet beenformed, to a second voltage value that is smaller than the first voltagevalue.

As is shown in typical view in FIG. 21, when the pattern formationoperation for each shot area S of the first through third shot areagroups S1 through S3 has ended, and a pattern formation operation forthe shot areas S of the fourth shot area group S4 is starting, the powersupply device 22 sets the value of the voltage that is supplied to theelectrode members 3 of the fourth electrode pattern 3D, which correspondto the shot areas S of the fourth shot area group S4 on the substrate Pwhere a pattern formation operation is currently underway, to the firstvoltage value, and sets both the value of the voltage that is suppliedto the electrode members 3 of the first through third electrode patterns3A through 3C, which correspond to the shot areas S of the first throughthird shot area groups S1 through S3 on the substrate P where a patternhas already been formed, and the value of the voltage that is suppliedto the electrode members 3 of the fifth through ninth electrode patterns3E through 3I, which correspond to the shot areas S of the fifth throughninth shot area groups S5 through S9 on the substrate P where a patternhas not yet been formed to the second voltage value which is smallerthan the first voltage value.

As is shown in typical view in FIG. 22, when the pattern formationoperation for each shot area S of the first through fourth shot areagroups S1 through S4 has ended, and a pattern formation operation forthe shot areas S of the fifth shot area group S5 is starting, the powersupply device 22 sets the value of the voltage that is supplied to theelectrode members 3 of the fifth electrode pattern 3E, which correspondto the shot areas S of the fifth shot area group S5 on the substrate Pwhere a pattern formation operation is currently underway, to the firstvoltage value, and sets both the value of the voltage that is suppliedto the electrode members 3 of the first through fourth electrodepatterns 3A through 3D, which correspond to the shot areas S of thefirst through fourth shot area groups S1 through S4 on the substrate Pwhere a pattern has already been formed, and the value of the voltagethat is supplied to the electrode members 3 of the sixth through ninthelectrode patterns 3F through 3I, which correspond to the shot areas Sof the sixth through ninth shot area groups S6 through S9 on thesubstrate P where a pattern has not yet been formed to the secondvoltage value which is smaller than the first voltage value.

Thereafter, in the same manner, pattern formation operations areexecuted for each shot area S with the value of the voltage that issupplied to the electrode members of the electrode patterns whichcorrespond to the shot area groups where a pattern formation operationis currently underway set to the first voltage value, and with the valueof the voltage that is supplied to the electrode members 3 of electrodepatterns which correspond to the other shot area groups being set to thesecond voltage value.

After a pattern has been formed on all of the shot areas S of thesubstrate P, namely, when exposure of all of the shot areas S has ended,the power supply device 22 stops the supply of voltage to all of theplurality of electrode members 3. The control unit 5 then begins anoperation to transport (i.e., unload) the exposed substrate P away fromthe holding member 20.

In the present embodiment as well, because the power supply device 22regulates the voltage that is supplied to the respective electrodemembers 3 in accordance with the information relating to the patternthat is to be formed on the substrate P, an operation to transport(i.e., unload) the substrate P away can be executed rapidly at the sametime as the operation to hold the substrate P is being properlyexecuted. Accordingly, in a state in which the substrate P is beingproperly held, the operation to form a pattern on the substrate P can beproperly executed, and it is possible to manufacture a device which hasa desired performance. Moreover, throughput can be improved and this cancontribute to an improvement in device productivity.

Fifth Embodiment

Next, a description will be given of a fifth embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiments are given thesame symbols and any description thereof is simplified or omitted.

FIG. 23 is a view showing a holding member 20B according to the fifthembodiment. In the present embodiment, 18 positive electrodes 31 (31A to31R) and 18 negative electrodes 32 (32A to 32R), which correspondrespectively to the 18 positive electrodes 31 (31A to 31R), are providedon a holding member 20B. The first, second, . . . , up to the eighteenthpositive electrodes 31A, 31B, . . . , 31R correspond respectively to thefirst, second, . . . , up to the eighteenth negative electrodes 32A,32B, . . . , 32R. Note that, in FIG. 23, the supporting members 41A,41B, and 41C are omitted from the drawings.

A first, second, . . . , up to an eighteenth electrode pattern 3A, 3B, .. . , 3R are formed by each of the first, second, . . . , up to theeighteenth positive electrodes 31A, 31B, . . . , 31R and the first,second, . . . , up to the eighteenth negative electrodes 32A, 32B, . . ., 32R.

FIG. 24 is a view showing a relationship between the electrode members 3according to the present embodiment and the shot areas S that are set onthe substrate P. In the same way as in the above described embodiments,a first, second, . . . , up to a ninth shot area group S1, S2, . . . ,S9 are set on the substrate P.

As is shown in FIG. 24, each of the plurality of electrode members 3 hasa size and shape that corresponds to the pattern information, and ispositioned on the holding member 20 in accordance with the patterninformation. As is described above, the pattern information includes atleast one of information relating to the shot areas S on the substrate Pand, consequently, information relating to the chips that are to beformed on the substrate P.

As is shown in FIG. 24, the plurality of electrode members 3 arearranged in accordance with information relating to the shot areas Sthat are set on the substrate P. In the present embodiment, the size inthe Y axial direction of the respective electrode members 3 is set so asto substantially match half the size in the Y axial direction of theshot areas S. Namely, the size in the Y axial direction of one shot areaS is set so as to substantially match the size in the Y axial directionof two electrode members 3. Moreover, the size in the X axial directionof each of the first through eighteenth electrode patterns 3A through 3Rthat are formed by the electrode members 3 is set so as to correspond tothe size in the X axial direction of each of the first through ninthshot area groups S1 through S9 that are formed by the shot areas S.

Namely, the respective electrode members 3 are arranged so as tocorrespond to the plurality of shot areas S. In the present embodiment,the first and second electrode patterns 3A and 3B are arranged so as tocorrespond to the first shot area group S1, and the third and fourthelectrode patterns 3C and 3D are arranged so as to correspond to thesecond shot area group S2. In the same way, the fifth and sixthelectrode patterns 3E and 3F are arranged so as to correspond to thethird shot area group S3, the seventh and eighth electrode patterns 3Gand 3H are arranged so as to correspond to the fourth shot area groupS4, the ninth and tenth electrode patterns 3I and 3J are arranged so asto correspond to the fifth shot area group S5, the eleventh and twelfthelectrode patterns 3K and 3L are arranged so as to correspond to thesixth shot area group S6, the thirteenth and fourteenth electrodepatterns 3M and 3N are arranged so as to correspond to the seventh shotarea group S7, the fifteenth and sixteenth electrode patterns 3O and 3Pare arranged so as to correspond to the eighth shot area group S8, andthe seventeenth and eighteenth electrode patterns 3Q and 3R are arrangedso as to correspond to the ninth shot area group S9.

Next, an example of an operation of the holding member 20B according tothe present embodiment will be described. At a predetermined timingprior to the commencement of the exposure of the substrate P, exposureconditions which include pattern information (i.e., pattern formationconditions) are input by means of the input device 7. The voltage thatis supplied to each electrode member 3 is regulated by the power supplydevice 22 in accordance with the pattern information that has been inputby means of the input device 7. Note that the exposure conditionsincluding the pattern information (i.e., the pattern formationconditions) may be stored in advance in the storage device 8, and thevoltage that is supplied to each electrode member 3 may be regulated bythe power supply device 22 in accordance with pattern information thatis stored in this storage device 8.

In the present embodiment, a description is given of an example in whichthe control unit 5 firstly exposes the shot areas S of the first shotarea group S1, and then sequentially exposes the shot areas S of thesecond, third, . . . , up to the eighth shot area groups S2, S3, . . . ,S8, and then finally exposes the shot areas S of the ninth shot areagroup S9.

After a substrate P has been placed on the holding surface 19 of theholding member 20 that is provided with the electrode members 3, inorder to attract the substrate P to the holding surface 19 byelectrostatic force, the control unit 5 supplies a predetermined voltageto the electrode members 3 using the power supply device 22. In thepresent embodiment, the power supply device 22 supplies voltage of apredetermined value to the electrode members 3 that correspond to shotarea groups on the substrate P where a pattern formation operation iscurrently underway, and sets the value of the voltage that is suppliedto electrode members that correspond to the other shot area groups toOFF.

For example, as is shown in typical view in FIG. 24, when a patternformation operation is started for the shot areas S of the third shotarea group S3, the power supply device 22 supplies voltage of apredetermined value to (i.e., sets to ON) the electrode members 3 of thefifth and sixth electrode patterns 3E and 3F which correspond to theshot areas S of the third shot area group S3 on the substrate P where apattern formation operation is currently underway, and sets to OFF boththe value of the voltage that is supplied to the electrode members 3 ofthe first through fourth electrode patterns 3A through 3D whichcorrespond to the shot areas S of the first and second shot area groupsS1 and S2 on the substrate P where a pattern has already been formed,and the value of the voltage that is supplied to the electrode members 3of the seventh through 18th electrode patterns 3G through 3R whichcorrespond to the shot areas S of the fourth through ninth shot areagroups S4 through S9 on the substrate P where a pattern has not yet beenformed.

As is shown in typical view in FIG. 25, when the pattern formationoperation for each shot area S of the first through third shot areagroups S1 through S3 has ended, and a pattern formation operation forthe shot areas S of the fourth shot area group S4 is starting, the powersupply device 22 supplies voltage of a predetermined value to (i.e.,sets to ON) the electrode members 3 of the seventh and eighth electrodepatterns 3G and 3H which correspond to the shot areas S of the fourthshot area group S4 on the substrate P where a pattern formationoperation is currently underway, and sets to OFF both the value of thevoltage that is supplied to the electrode members 3 of the first throughsixth electrode patterns 3A through 3F which correspond to the shotareas S of the first through third shot area groups S1 through S3 on thesubstrate P where a pattern has already been formed, and the value ofthe voltage that is supplied to the electrode members 3 of the ninththrough eighteenth electrode patterns 31 through 3R which correspond tothe shot areas S of the fifth through ninth shot area groups S5 throughS9 on the substrate P where a pattern has not yet been formed.

Thereafter, in the same manner, pattern formation operations areexecuted for each shot area S with voltage of a predetermined valuebeing supplied only to the electrode members of the electrode patternswhich correspond to the shot area groups where a pattern formationoperation is currently underway, and with the value of the voltage thatis supplied to the electrode members 3 of electrode patterns whichcorrespond to the other shot area groups being set to OFF.

After a pattern has been formed on all of the shot areas S of thesubstrate P, namely, when exposure of all of the shot areas S has ended,the power supply device 22 stops the supply of voltage to all of theplurality of electrode members 3. The control unit 5 then begins anoperation to transport (i.e., unload) the exposed substrate P away fromthe holding member 20.

In the present embodiment as well, because the power supply device 22regulates the voltage that is supplied to the respective electrodemembers 3 in accordance with the information relating to the patternthat is to be formed on the substrate P, an operation to transport away(i.e., unload) the substrate P can be executed rapidly at the same timeas the operation to hold the substrate P is being properly executed.Accordingly, in a state in which the substrate P is being properly held,the operation to form a pattern on the substrate P can be properlyexecuted, and it is possible to manufacture a device which has a desiredperformance. Moreover, throughput can be improved and this cancontribute to an improvement in device productivity.

Sixth Embodiment

Next, a description will be given of a sixth embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiments are given thesame symbols and any description thereof is simplified or omitted.

FIG. 26 is a view showing a relationship between the electrode members 3according to the present embodiment and the shot areas S that are set onthe substrate P. In the same way as in the above described fifthembodiment, the holding member 2013 is provided with 18 positiveelectrodes 31 (31A to 31R) and 18 negative electrodes 32 (32A to 32R)which correspond respectively to the 18 positive electrodes 31 (31A to31R). A first, second, . . . , up to an eighteenth electrode pattern 3A,3B, . . . , 3R are Ruined by each of the first, second, . . . , up tothe eighteenth positive electrodes 31A, 31B, . . . , 31R and the first,second, . . . , up to the eighteenth negative electrodes 32A, 32B, . . ., 32R.

In the present embodiment, a first, second, . . . , up to a sixth shotarea group S1, S2, . . . , S6 are formed on the substrate P. As is shownin FIG. 26, the plurality of electrode members 3 are arranged inaccordance with information relating to the shot areas S that are set onthe substrate P. In the present embodiment, the size in the Y axialdirection of the respective electrode members 3 is set so as to besubstantially one third the size of the shot areas S in the Y axialdirection. Namely, the size in the Y axial direction of one shot area Sis set so as to substantially match the size in the Y axial direction ofthree electrode members 3. Moreover, the size in the X axial directionof each of the first through eighteenth electrode patterns 3A through 3Rthat are formed by the electrode members 3 is set so as to correspond tothe size in the X axial direction of each of the first through sixthshot area groups S1 through S9 that are formed by the shot areas S.

Namely, in the present embodiment as well, the respective electrodemembers 3 are arranged so as to correspond to the plurality of shotareas S. In the present embodiment, the first through third electrodepatterns 3A through 3C are arranged so as to correspond to the firstshot area group S1, and the fourth through sixth electrode patterns 3Dthrough 3F are arranged so as to correspond to the second shot areagroup S2. In the same way, the seventh through ninth electrode patterns3G through 3I are arranged so as to correspond to the third shot areagroup S3, the tenth through eleventh electrode patterns 3J through 3Lare arranged so as to correspond to the fourth shot area group S4, thethirteenth through fifteenth electrode patterns 3M through 3O arearranged so as to correspond to the fifth shot area group S5, and thesixteenth through eighteenth electrode patterns 3P through 3R arearranged so as to correspond to the sixth shot area group S6.

Next, an example of an operation of the holding member 20B according tothe present embodiment will be described. At a predetermined timingprior to the commencement of the exposure of the substrate P, exposureconditions which include pattern information (i.e., pattern formationconditions) are input by means of the input device 7. The voltage thatis supplied to each electrode member 3 is regulated by the power supplydevice 22 in accordance with the pattern information that has been inputby means of the input device 7. Note that the exposure conditionsincluding the pattern information (i.e., the pattern formationconditions) may be stored in advance in the storage device 8, and thevoltage that is supplied to each electrode member 3 may be regulated bythe power supply device 22 in accordance with pattern information thatis stored in this storage device 8.

In the present embodiment, a description is given of an example in whichthe control unit 5 firstly exposes the shot areas S of the first shotarea group S1, and then sequentially exposes the shot areas S of thesecond, third, . . . , up to the fifth shot area groups S2, S3, . . . ,S5, and then finally exposes the shot areas S of the sixth shot areagroup S6.

After a substrate P has been placed on the holding surface 19 of theholding member 20 that is provided with the electrode members 3, inorder to attract the substrate P to the holding surface 19 byelectrostatic force, the control unit 5 supplies a predetermined voltageto the electrode members 3 using the power supply device 22. In thepresent embodiment, the power supply device 22 supplies voltage of apredetermined value to the electrode members 3 that correspond to shotarea groups on the substrate P where a pattern formation operation iscurrently underway, and sets the value of the voltage that is suppliedto electrode members that correspond to the other shot area groups toOFF.

For example, as is shown in typical view in FIG. 26, when a patternformation operation is started for the shot areas S of the second shotarea group S2, the power supply device 22 supplies voltage of apredetermined value to (i.e., sets to ON) the electrode members 3 of thefourth through sixth electrode patterns 3D through 3F which correspondto the shot areas S of the second shot area group S2 on the substrate Pwhere a pattern formation operation is currently underway, and sets toOFF both the value of the voltage that is supplied to the electrodemembers 3 of the first through third electrode patterns 3A through 3Cwhich correspond to the shot areas S of the first shot area group S1 onthe substrate P where a pattern has already been formed, and the valueof the voltage that is supplied to the electrode members 3 of theseventh through 18th electrode patterns 3G through 3R which correspondto the shot areas S of the third through sixth shot area groups S3through S6 on the substrate P where a pattern has not yet been formed.

As is shown in typical view in FIG. 27, when the pattern formationoperation for each shot area S of the first and second shot area groupsS1 and S2 has ended, and a pattern formation operation for the shotareas S of the third shot area group S43 is starting, the power supplydevice 22 supplies voltage of a predetermined value to (i.e., sets toON) the electrode members 3 of the seventh through ninth electrodepatterns 3G through 3I which correspond to the shot areas S of the thirdshot area group S3 on the substrate P where a pattern formationoperation is currently underway, and sets to OFF both the value of thevoltage that is supplied to the electrode members 3 of the first throughsixth electrode patterns 3A through 3F which correspond to the shotareas S of the first and second shot area groups S1 and S2 on thesubstrate P where a pattern has already been formed, and the value ofthe voltage that is supplied to the electrode members 3 of the tenththrough eighteenth electrode patterns 3J through 3R which correspond tothe shot areas S of the fourth through sixth shot area groups S4 throughS6 on the substrate P where a pattern has not yet been formed.

Thereafter, in the same manner, pattern formation operations areexecuted for each shot area S with voltage of a predetermined valuebeing supplied only to the electrode members of the electrode patternswhich correspond to the shot area groups where a pattern formationoperation is currently underway, and with the value of the voltage thatis supplied to the electrode members 3 of electrode patterns whichcorrespond to the other shot area groups being set to OFF.

After a pattern has been formed on all of the shot areas S of thesubstrate P, namely, when exposure of all of the shot areas S has ended,the power supply device 22 stops the supply of voltage to all of theplurality of electrode members 3. The control unit 5 then begins anoperation to transport (i.e., unload) the exposed substrate P away fromthe holding member 20.

In the present embodiment as well, because the power supply device 22regulates the voltage that is supplied to the respective electrodemembers 3 in accordance with the information relating to the patternthat is to be formed on the substrate P, an operation to transport away(i.e., unload) the substrate P can be executed rapidly at the same timeas the operation to hold the substrate P is being properly executed.Accordingly, in a state in which the substrate P is being properly held,the operation to form a pattern on the substrate P can be properlyexecuted, and it is possible to manufacture a device which has a desiredperformance. Moreover, throughput can be improved and this cancontribute to an improvement in device productivity.

Note that in the above described fifth and sixth embodiments, examplesare given of cases in which the value of the voltage that is supplied tothe electrode members 3 which correspond to shot area groups other thanthe shot area groups where a pattern formation operation is currentlyunderway is set to OFF, however, it is also possible for the value ofthe voltage that is supplied to the electrode members 3 which correspondto shot area groups where a pattern formation operation is currentlyunderway to be set to a first voltage value, and for the value of thevoltage that is supplied to the electrode members 3 which correspond toshot area groups other than the shot area groups where a patternformation operation is currently underway to be set to a second voltagevalue (excluding 0) that is smaller than the first voltage value.

Moreover, in the above described fifth and sixth embodiments, examplesare given of cases in which the value of the voltage that is supplied tothe electrode members 3 which correspond to shot area groups where apattern has not yet been formed is smaller than the value of the voltagethat is supplied to the electrode members 3 which correspond to shotarea groups where a pattern formation operation is currently underway,however, it is also possible for the value of the voltage that issupplied to the electrode members 3 which correspond to shot area groupswhere a pattern has not yet been formed to be the same as the value ofthe voltage that is supplied to the electrode members 3 which correspondto shot area groups where a pattern formation operation is currentlyunderway.

In the above described embodiment, even when the width of the shot areasis altered it is still possible to execute voltage control for each shotarea simply by altering the number of electrodes which are controlledsimultaneously. Note that, in the above described embodiment, the widthof the electrodes is set to half the width of the shot areas, however,it is also possible to provide an even larger number of electrodeswithin the width of each shot area.

Seventh Embodiment

Next, a description will be given of a seventh embodiment. In thedescription given below, component elements that are identical orequivalent to those in the above described embodiments are given thesame symbols and any description thereof is simplified or omitted.

In the above described first through sixth embodiments, the movingmechanism 44 that moves the substrate P relative to the holding member20 is provided with supporting members 41A through 41C that are providedon the holding member 20, however, the characteristic portion of theseventh embodiment lies in the fact that the moving mechanism isprovided with a transporting member which transports a substrate P ontoand away from the holding member.

FIG. 28 is a perspective view showing a moving mechanism 44B accordingto the seventh embodiment. The moving mechanism 44B of the presentembodiment is provided with a transporting member 51 that transports asubstrate P onto and away from a holding member 20C. The movingmechanism 44B moves the substrate P both in a direction in which itapproaches and a direction in which it moves away from the holdingsurface 19 of the holding member 20 using the transporting member 51.

As is shown in FIG. 28, the transporting member 51 of the presentembodiment is provided with an arm portion 52, and a plurality ofsupporting portions 53A, 53B, and 53C that are provided on the armportion 52 and support a predetermined area of the rear surface of thesubstrate P (i.e., the rear surface of the peripheral portion of thesubstrate P, in this embodiment). In the present embodiment, thetransporting member 51 is provided with the three supporting portions53A, 53B, and 53C.

The arm portion 52 is a circular arc-shaped component whose are lieswithin the XY plane, and is shaped so as to conform to a side surface ofthe holding member 20C. The arm portion 52 can be positioned so as toencircle the side surface of the holding member 20C. The arm portion 52also has a first protruding portion 52A and a second protruding portion52B that protrude inwardly (i.e., towards the center of the circulararc-shaped arm portion 52) provided respectively on its two distal ends.In addition, the arm portion 52 has a third protruding portion 52C thatprotrudes inwardly substantially in the center between the two distalends. First, second, and third supporting portions 53A, 53B, and 53C areprovided respectively on the first, the second, and the third protrudingportions 52A, 52B, and 52C of the arm portion 52. The first, second, andthird supporting portions 53A, 53B, and 53C are each shaped so as toprotrude upwardly (i.e., in the +Z direction) from the arm portion 52.

The holding member 20C is provided with first through ninth electrodepatterns 3A through 3I. In addition, grooves 54A and 54B that extend inthe Y axial direction are formed respectively on the side surface on the−X side and the side surface on the +X side of the holding member 20C.Moreover, the holding member 20C is provided with first, second, andthird recessed portions 55A, 55B, and 55C that are shaped so as tocorrespond respectively to the first, second, and third protrudingportions 52A, 52B, and 52C. Each of the first, second, and thirdrecessed portions 55A, 55B, and 55C is formed in the side surface of theholding member 20C, and these recessed portions are able to houserespectively the first, second, and third protruding portions 52A, 52B,and 52C. In the present embodiment, the third recessed portion 55C whichcorresponds to the third protruding portion 52C is positioned on the −Yside (i.e., on the first electrode pattern 3A side) relative to thecenter of the holding surface 19. The first and second recessed portions55A and 55B which correspond to the first and second protruding portions52A and 52B are positioned on the +Y side (i.e., on the ninth electrodepattern 3I side) relative to the center of the holding surface 19.

Each of the first, second, and third recessed portions 55A, 55B, and 55Care formed so as to extend in the Z axial direction, and each one isformed such that a notch is cut in a portion of the holding surface 19.Moreover, the first, second, and third recessed portions 55A, 55B, and55C are also formed so as to join together the holding surface 19 andthe grooves 54. The first, second, and third protruding portions 52A,52B, and 52C are each able to move in the Z axial direction, in thefirst, second, and third recessed portions 55A, 55B, and 55C, and alongthe first, second, and third recessed portions 55A, 55B, and 55C.

Each of the first, second, and third recessed portions 55A, 55B, and 55Cis formed such that a notch is cut in a portion of the holding surface19, and then portions of the rear surface of a substrate P that ismounted on the holding surface 19 are exposed at the first, second, andthird recessed portions 55A, 55B, and 55C.

When the first, second, and third protruding portions 52A, 52B, and 52Cof the transporting member 51 are placed in the first, second, and thirdrecessed portions 55A, 55B, and 55C of the holding member 20C, themoving mechanism 44B is able to move the transporting member 51 suchthat top ends of the first, second, and third supporting portions 53A,53B, and 53C are positioned on the +Z side of the holding surface 19,and is also able to move the transporting member 51 such that top endsof the first, second, and third supporting portions 53A, 53B, and 53Care positioned on the −Z side of the holding surface 19.

Because portions of the rear surface of the substrate P that has beenmounted on the holding surface 19 are exposed at the first, second, andthird recessed portions 55A, 55B, and 55C, the transporting member 51 isable to move the substrate P in the Z axial direction relative to theholding surface 19 of the holding member 20 at the same time as it issupporting the portions of the rear surface of the substrate P that areexposed at the first, second, and third recessed portions 55A, 55B, and55C using the supporting portions 53. Namely, when a substrate P isbeing supported by the first, second, and third supporting portions 53A,53B, and 53C of the transporting member 51, by moving this transportingmember 51 in the Z axial direction, the moving mechanism 44 is able tomove the substrate P in a direction in which the holding surface 19 ofthe holding member 20 and the rear surface of the substrate P approacheach other and in a direction in which they move away from each other.

When transporting (i.e., loading) a substrate P onto the holding member20C using the transporting member 51, the moving mechanism 44B positionsthe transporting member 51, which is supporting the substrate P by meansof the respective supporting portions 53A, 53B, and 53C, above theholding surface 19 of the holding member 20, and, when the top ends ofthe respective recessed portions 55A, 55B, and 55C have been positionedtogether with the respective protruding portions 52A, 52B, and 52C,moves the transporting member 51 in the −Z direction. The respectiveprotruding portions 52A, 52B, and 52C of the transporting member 51 areable to move in the −Z direction along the respective recessed portions55A, 55B, and 55C, and, in conjunction with the movement of thetransporting member 51 in the −Z direction, the rear surface of thesubstrate P which is supported by the supporting portions 53A, 53B, and53C comes into contact with the holding surface 19 of the holding member20. In addition, after the transporting member 51 has been moved furtherin the −Z direction, and the first and second protruding portions 52Aand 52B have been placed in the grooves 54A and 54B, the movingmechanism 44B moves the transporting member 51 in the −Y direction. Thefirst and second protruding portions 52A and 52B of the transportingmember 51 are able to move in the −Y direction on the inner side of thegrooves 54A and 54B. Because of this, the transporting member 51 is ableto move in the −Y direction and move away from the holding member 20Cwhile contact between the transporting member 51 and the holding member20C is limited.

Moreover, when transporting (i.e., unloading) the substrate P away fromthe top of the holding member 20 using the transporting member 51, themoving mechanism 44B positions the transporting member 51 on the −Y sideof the holding member 20C, and, when the positions of the first andsecond protruding portions 52A and 52B have been matched to those of thegrooves 54A and 54B, moves the transporting member 51 in the +Ydirection. The first and second protruding portions 52A and 52B of thetransporting member 51 are able to move in the +Y direction in thegrooves 54A and 54B along the grooves 54A and 54B, and, in conjunctionwith the movement of the transporting member 51 in the +Y direction, thepositions of the first and second protruding portions 52A and 52B arematched to those of the first and second recessed portions 55A and 55B.In addition, the position of the third protruding portion 52C is matchedto that of the third recessed portion 55C. When bottom ends of therespective recessed portions 55A, 55B, and 55C of the holding member 20Chave been positioned together with the respective protruding portions52A, 52B, and 52C of the transporting member 51, the transportingmechanism 44B moves the transporting member 51 in the +Z direction. Therespective protruding portions 52A, 52B, and 52C of the transportingmember 51 are able to move in the +Z direction on the inner side of therespective recessed portions 55A, 55B, and 55C, and, in conjunction withthe movement of the transporting member 51 in the +Z direction, portionsof the rear surface of the substrate P which is mounted on the holdingsurface 19 come into contact with the supporting portions 53A, 53B, and53C. If the transporting member 51 is then moved further in the +Zdirection, the substrate P becomes supported on the supporting portions53A, 53B, and 53C, and the rear surface of the substrate P is separatedfrom the holding surface 19. After the transporting member 51 is thenmoved further in the +Z direction, so that the holding member 20 issufficiently separated from the transporting member 51 which issupporting the substrate P, the moving mechanism 44B moves thetransporting member 51 in a predetermined direction. As a result, thesubstrate P is transported away from the holding member 20C by thetransporting member 51.

FIG. 29 is a typical view showing an example of an operation when theholding member 20C is separated from the substrate P by the movingmechanism 44B according to the present embodiment. As is shown in FIG.29, the moving mechanism 44B starts to move the substrate P relative tothe holding member 20C such that one portion of the rear surface of thesubstrate P moves away first from the holding surface 19 before otherportions thereof move away. In the present embodiment, the thirdsupporting portion 53C supports the portion of the rear surface of thesubstrate P that moves away first from the holding surface 19. In otherwords, the driving of the moving mechanism 44B is controlled such that,of the three supporting portions 53A, 53B, and 53C, the third supportingportion 53C starts to move away first from the holding surface 19 in the+Z direction before the other supporting portions 53A and 53B.

In the same way as in the above described embodiments, after voltage hasbeen supplied to the respective electrode members 3 of the plurality ofelectrode patterns 3A through 3I so as to attract the substrate P to theholding surface 19, the supply of voltage to the plurality of electrodemembers 3 is stopped in a predetermined sequence which corresponds tothe sequence in which a pattern is to be formed (i.e., a sequence inwhich the shot areas S are to be exposed). Namely, firstly, the supplyof voltage to the electrode members 3 of the first electrode pattern 3Ais stopped, and thereafter the supply of voltages to the electrodemembers 3 is stopped in the sequence of the second, the third, . . . ,and up to the ninth electrode patterns 3B, 3C, . . . , 3I. The movingmechanism 44B starts the movement of the substrate P relative to theholding member 20C such that the portion of the rear surface of thesubstrate P that corresponds to the electrode members 3 of the firstelectrode pattern 3A to which the supply of voltage was stopped first,namely, the portion adjacent to the edge of the substrate P on the −Yside is separated first from the holding surface 19 of the holdingmember 20.

In the present embodiment, of the plurality of supporting portions 53A,53B, and 53C, the third supporting member 53C is placed adjacent to theedge of the substrate P on the −Y side. The control unit 5 controls themoving mechanism 44B such that the third supporting member 53C starts tomove in the +Z direction from the holding surface 19 earlier than theother supporting members 53A and 53B. As a result, the substrate P canbe moved such that the portion in the vicinity of the edge on the −Yside of the substrate P that is supported by the third supporting member53C moves away first from the holding surface 19 of the holding member20.

Moreover, by providing a grounded conductive member in the thirdsupporting S portion 53C, electricity (i.e., any electric charge) whichis electrifying the substrate P is properly removed.

Moreover, in the present embodiment, it is possible to provide, forexample, in the supporting portions 53A and 53B, an electrostatic chuckmechanism that includes electrode members that generate electrostaticforce in order to attract the substrate P to the supporting portions 53Aand 53B.

Note that in the above described embodiment the moving mechanism 44Bmoves the substrate P relatively to a substantially static holdingmember 20, however, it is also possible to move the holding member 20relatively to a substantially static substrate P, or to move both theholding member 20 and the substrate P.

Note also that in each of the above described embodiments, the movingmechanisms 44, 44B are applied to the holding members 20, 20C whichinclude a plurality of electrode members, however, the moving mechanisms44, 44B can be applied to holding members each of which includes one ortwo electrode member(s).

Note also that in each of the above described embodiments, the holdingmembers 20, 20C can alternatively support the rear surface of thesubstrate P with multiple pin members (convex portions or protrudingportions) the distal ends of which are disposed on a plane. In the casein which the holding members 20, 20C include the multiple pin members,the plane comprising the distal ends of the multiple pin members can beapplied as the holding surface.

Note also that in each of the above described embodiments, theantistatic device 47 that removes electrostatic charge on the substrateP is provided with a grounded conductive member 48 that touches theholding surface 19 of the holding member 20, however, it may also beprovided with a grounded conductive member that touches a portion of theside surface or front surface of the substrate P. Moreover, providedthat electrostatic charge on the substrate P can be removed, then it isnot essential for the conductive member to be grounded.

In addition, in each of the above described embodiments, a descriptionis given of an example in which the electrostatic chuck mechanism iswhat is known as a bipolar type of mechanism, however, it is alsopossible for a unipolar type of mechanism to be used.

Furthermore, in each of the above described embodiments, the electrodemembers are divided only in the Y axial direction, and pairs of positiveelectrodes and negative electrodes are only created in the X axialdirection, however, it is also possible to also divide the electrodemembers in the X axial direction, and set the voltage supplied to thoseelectrode members that correspond to areas where exposure in the X axialdirection has ended to OFF. For example, it is also possible to positiona plurality of electrode members such that positive electrodes andnegative electrodes are placed at intervals relating to the chip width,or at intervals relating to the width of the slit (i.e., the projectionarea) where scanning exposure is performed, and to sequentially set toOFF the voltage of electrode members that correspond to the width of theslit or of chips where exposure has ended.

Furthermore, in a case in which the electrode members are divided inboth the X axial direction and the Y axial direction, predeterminednumbers of the electrode members can be selected from among theplurality of the electrode members, in accordance with the informationof the pattern formed on the substrate P (e.g., the size of the shotarea S). That is, the predetermined numbers of the electrode members areassigned to each of the shot areas S. In this case, the power supplydevice regulates the voltage supplied to the numbers of the electrodemembers, which are assigned to the every shot areas S.

Moreover, in each of the above described embodiments, the voltages of apositive electrode and negative electric pair which are positioned inthe X axial direction are changed simultaneously, however, it is alsopossible to change the voltage of only one electrode member.

Note also that not only can a semiconductor wafer which is used tomanufacture a semiconductor device be used as the substrate P of theabove described embodiments, but it is also possible to use a glasssubstrate which is used for a display device, a ceramic wafer which isused for a thin-film magnetic head, an original plate (i.e., syntheticquartz or silicon wafer) of a mask or reticle which is used in anexposure apparatus, film member, or the like. Moreover, the substrate isnot limited to round shape, but may be rectangular or other shapes.

As the exposure apparatus EX, in addition to a step-and-scan type ofscanning exposure apparatus (i.e., a scanning stepper) which makes ascanning exposure of a pattern on a mask M while moving the mask M and asubstrate P in synchronization, it is also possible to use astep-and-repeat type of projection scanning device (i.e., a stepper)that collectively exposes the pattern on a mask M while the mask M andsubstrate P are static, and moves the substrate P in sequential steps.

Furthermore, in a step-and-repeat type of exposure, it is also possibleto transfer to a contracted image of a first pattern onto a substrate Pusing a projection optical system while the first pattern and thesubstrate P are substantially stationary, and to then superimpose areduced image of a second pattern partially onto the first pattern usingthe projection optical system while the second pattern and the substrateP are substantially stationary, and then collectively expose it onto thesubstrate P (i.e., using a stitch type of collective exposureapparatus). Moreover, as a stitch type of collective exposure apparatus,it is also possible to use a step-and-stitch type of exposure apparatusthat partially superimposes and then transfers at least two patternsonto a substrate P, and moves the substrate P sequentially.

Moreover, as is disclosed, for example, in U.S. Pat. No. 6,611,316, thepresent invention can also be applied to an exposure apparatus thatsynthesizes two mask patterns on a substrate via a projection opticalsystem, and performs a double exposure substantially simultaneously of asingle shot area on the substrate by means of a single scan exposure.

Moreover, the present invention can also be applied to a twin stage typeof exposure apparatus that is provided with a plurality of substratestages such as is described in U.S. Pat. Nos. 6,341,007, 6,400,441,6,549,269, 6,590,634, 6,208,407, and 6,262,796.

Furthermore, as is described in, for example, Japanese PatentApplication Publication No. H11-135400 A (corresponding to PCTInternational Publication No. 1999/23692) and U.S. Pat. No. 6,897,963,the present invention can also be applied to an exposure apparatus thatis provided with a substrate stage that holds a substrate, and ameasurement stage on which are mounted reference components on whichreference marks are formed and/or various types of photoelectricsensors. The present invention can also be applied to an exposureapparatus that is provided with a plurality of substrate stages andmeasurement stages.

The type of exposure apparatus EX that is used is not limited to anexposure apparatus for manufacturing a semiconductor device that exposesa semiconductor device pattern onto a substrate P, and the presentinvention may also be broadly applied to exposure apparatuses formanufacturing liquid crystal display elements or manufacturing displaysand the like, and to exposure apparatuses for manufacturing thin-filmmagnetic heads, image pickup elements (CCD), micro machines, MEMS, DNAchips, or reticles and masks, and the like.

As has been described above, the exposure apparatus EX according to theembodiments is manufactured by assembling various subsystems thatinclude the respective component elements such that they havepredetermined levels of mechanical accuracy, electrical accuracy, andoptical accuracy. In order to secure these levels of accuracy, variousadjustments are made before and after the assembly step, includingadjustments to achieve optical accuracy in the various optical systems,adjustments to achieve mechanical accuracy n the various mechanicalsystems, and adjustments to achieve electrical accuracy in the variouselectrical systems. The assembly step to assemble an exposure apparatusfrom the various subsystems includes making mechanical connections,electrical circuit wiring connections, and air pressure circuit tubeconnections and the like between the various subsystems. Prior to theassembly step to assemble an exposure apparatus from the varioussubsystems, it is of course necessary to perform assembly steps toassemble the respective individual subsystems. Once the assembly step toassemble an exposure apparatus from the various subsystems has ended,comprehensive adjustments are made so as to secure various levels ofaccuracy in the exposure apparatus as a whole. Note that it is desirablefor the manufacturing of the exposure apparatus to be conducted in aclean room in which temperature and cleanliness and the like arecontrolled.

As is shown in FIG. 30, a micro device such as a semiconductor device ismanufactured via a step 201 in which the functions and performance ofthe micro device are designed, a step 202 in which a mask (i.e., areticle) that is based on the design step is manufactured, a step 203 inwhich a substrate that forms the base material of the device ismanufactured, a substrate processing step 204 that includes substrateprocessing (i.e., exposure processing) in which a substrate is exposedusing an image of a pattern on a mask and the exposed substrate is thendeveloped, a device assembly step 205 (including working processes suchas a dicing step, a bonding step, a packaging step and the like), and aninspection step 206.

Note that in the above described embodiments, descriptions are given ofexamples in which the device that is used to form a pattern on asubstrate P is an exposure apparatus that forms a pattern on aphotosensitive substrate P by irradiating exposure light EL onto thesubstrate P, however, the holding apparatus of the present invention canalso be applied to various pattern forming devices that form a patternon a substrate P. Examples of this type of pattern forming deviceinclude inkjet devices that form a pattern on a substrate by dischargingink droplets, for example, onto the substrate, and nanoimprint devicesthat press together an original plate on which a concavo-convex patternhas been formed and a substrate on which an organic material has beencoated while heating the two to more than the glass transitiontemperature of the substrate, and then separate the original plate fromthe substrate and cool the substrate so as to transfer the pattern onthe original plate onto the substrate. When a holding apparatus thatholds the substrate is provided in these apparatuses, if the substrateis held using the holding apparatus of the present invention, then thesubstrate can be held in a desired state. For example, if the surface ofa substrate P is divided into a plurality of micro areas, and anoperation to form a pattern on each of these micro areas (i.e., anoperation to discharge droplets of ink) is executed by an inkjet device,then the electrode members of the holding member are positioned inaccordance with the micro areas, and the power supply device of theholding apparatus regulates the voltage that is supplied to each of theplurality of the electrode members that are provided in the holdingapparatus in accordance with the sequence in which the pattern is to beformed.

The holding apparatus according to the present invention is not limitedto the pattern forming apparatus, and can alternatively be applied to,for example, a holding apparatus provided in a substrate processingapparatus such as an apparatus for coating a resist onto the substrateP, an apparatus for developing the pattern formed on the substrate P, orthe like. In a case in which an aspect of the present invention isapplied to this holding apparatus, the power supply device 22 canregulate the voltage supplied to the electrode members with disregard tothe pattern information.

As far as is permitted, the disclosures in all of the Japanese PatentPublications and U.S. Patents related to exposure apparatuses and thelike cited in the above respective embodiments and modified examples areincorporated herein by reference.

Note that embodiments of the present invention have been describedabove, however, the present invention can be used by appropriatelycombining all of the above described component elements, or, in somecases, a portion of the component elements may not be used.

1-19. (canceled)
 20. A holding apparatus comprising: a holding memberthat has a holding surface, the holding surface holding a substrate onwhich a pattern is to be formed; a plurality of first electrode membersthat are provided on the holding member and that are arranged inaccordance with pattern information relating to the pattern, and thatgenerate electrostatic force in accordance with supply of a voltage inorder to attract the substrate to the holding surface; and a movingmechanism that, after a pattern has been formed on the substrate, movesthe holding member and the substrate relative to each other such thatthe holding surface and the substrate are separated from each other. 21.The holding apparatus according to claim 20, wherein the movingmechanism starts a relative movement between the holding member and thesubstrate such that one portion of the substrate becomes separated firstfrom the holding surface before other portions of the substrate.
 22. Theholding apparatus according to claim 20, wherein after voltage has beensupplied to the plurality of first electrode members and the substratehas been made to attract to the holding surface, the stopping of thesupply of voltage to the plurality of first electrode members is carriedout in a predetermined sequence, and the moving mechanism starts arelative movement between the holding member and the substrate such thata portion of the substrate that corresponds to the first electrodemembers where the supplying of voltage was stopped first becomesseparated first from the holding surface.
 23. The holding apparatusaccording to claim 20, wherein after voltage has been supplied to theplurality of first electrode members and the substrate has been made toattract to the holding surface, the value of the voltage that issupplied to each one of the first electrode members is sequentiallyreduced, and the moving mechanism starts a relative movement between theholding member and the substrate such that a portion of the substratethat corresponds to the first electrode members where the voltage valuewas reduced first among the plurality of the first members becomesseparated first from the holding surface.
 24. The holding apparatusaccording to claim 20, wherein the moving mechanism comprises asupporting member that is capable of moving while supporting apredetermined area of a rear surface of the substrate.
 25. The holdingapparatus according to claim 23, further comprising a second electrodemember that is provided on the supporting member, and that generateselectrostatic field in accordance with supply of a voltage in order toattract the substrate to the holding surface.
 26. The holding apparatusaccording to claim 20, wherein the moving mechanism comprises atransporting member that transports the substrate away from the holdingmember.
 27. The holding apparatus according to claim 20, furthercomprising an antistatic device that removes electrostatic charge on thesubstrate when the holding member and the substrate are being separatedfrom each other.
 28. The holding apparatus according to claim 27,wherein the moving mechanism comprises a grounded conductive member thatis capable of moving while supporting the substrate, and the antistaticdevice comprises the conductive member.
 29. The holding apparatusaccording to claim 28, wherein the moving mechanism starts a movement ofthe substrate relative to the holding member such that one portion ofthe substrate becomes separated first from the holding surface beforeother portions of the substrate, and the conductive member supports theone portion of the substrate.
 30. A holding apparatus comprising: aholding member that has a holding surface that holds a substrate; atleast one first electrode member that is provided on the holding member,and that generates electrostatic field in accordance with supply of avoltage in order to attract the substrate to the holding surface; and amoving mechanism that has a supporting surface that supports thesubstrate and that comprises a moving member that moves the substraterelative to the holding member while supporting a predetermined area ofthe substrate such that the holding surface and the substrate areseparated from each other, and a second electrode member that isprovided on the moving member, and that generates electrostatic field inaccordance with supply of a voltage in order to attract the substrate tothe supporting surface.
 31. The holding apparatus according to claim 30,wherein, after the supply of voltage has been stopped to at least theone first electrode member, the moving mechanism starts the movement ofthe substrate.
 32. The holding apparatus according to claim 30, whereinthe holding member comprises a plurality of the first electrode members,and after voltage has been supplied to the plurality of first electrodemembers and the substrate has been made to attract to the holdingsurface, the stopping of the supply of voltage to the plurality of thefirst electrode members is carried out in a predetermined sequence, andthe moving mechanism starts a movement of the substrate relative to theholding member such that a portion of the substrate that corresponds tothe first electrode members where the supplying of voltage was stoppedfirst among the plurality of the first electrode members becomesseparated first from the holding surface.
 33. The holding apparatusaccording to claim 30, wherein the holding member comprises a pluralityof the first electrode members, and after voltage has been supplied tothe plurality of first electrode members and the substrate has been madeto attract to the holding surface, the value of the voltage that issupplied to each one of the first electrode members is sequentiallyreduced, and the moving mechanism starts a movement of the substraterelative to the holding member such that one portion of the substratethat corresponds to the first electrode members where the voltage valuewas reduced first among the plurality of the first members becomesseparated first from the holding surface.
 34. The holding apparatusaccording to claim 30, wherein the moving mechanism comprises aplurality of the moving members, and the second electrode member isprovided on at least one of the plurality of the moving members.
 35. Theholding apparatus according to claim 34, further comprising a groundedconductive member that is provided on the moving member, which isdifferent from the moving member on which the second electrode member isprovided, and that removes electrostatic charge on the substrate whenthe holding member and the substrate are being separated from eachother.
 36. A holding apparatus comprising: a holding member that has aholding surface that holds a substrate; an electrode member that isprovided on the holding member and generate electrostatic force in orderto attract the substrate to the holding surface; a moving mechanism thatmoves the substrate and the holding member relatively to each other suchthat the holding surface and the substrate are separated from eachother; and an antistatic device that removes electrostatic charge on thesubstrate when the holding member and the substrate are being separatedfrom each other.
 37. The holding apparatus according to claim 36,wherein the moving mechanism comprises a plurality of supporting membersthat are provided on the holding portion and that are capable of movingwhile supporting predetermined areas of the rear surface of thesubstrate, and at least one of the supporting members comprises agrounded conductive member, and the antistatic device comprises theconductive member.
 38. The holding apparatus according to claim 37,wherein the moving mechanism starts a movement of the substrate relativeto the holding member such that one portion of the substrate becomesseparated first from the holding surface before other portions of thesubstrate, and the conductive member supports the one portion of thesubstrate. 39-49. (canceled)
 50. An exposure method for exposing asubstrate with exposure light from a pattern, the method comprising:mounting the substrate on a holding surface of a holding member on whicha plurality of first electrode members are provided; supplying voltageto the first electrode members in order to attract the substrate to theholding surface by electrostatic force sequentially irradiating shotareas on the substrate with exposure light from the pattern, separatingthe substrate on which the pattern has been formed from the holdingsurface, wherein the value of a first voltage that is supplied to thefirst electrode members, which correspond to shot areas where theirradiation of the exposure light has not yet been formed and where theirradiation of the exposure light is currently underway, is higher thanthe value of a second voltage that is supplied to the first electrodemembers, which are different from the first electrode members to whichthe first voltage is supplied; and separating the substrate on which thepattern has been formed from the holding surface, wherein a relativemovement between the holding member and the substrate is started suchthat one portion of the substrate becomes separated first from theholding surface before other portions of the substrate.
 51. The exposuremethod according to claim 50, wherein after voltage has been supplied tothe plurality of first electrode members and the substrate has been madeto attract to the holding surface, the stopping of the supply of voltageto the plurality of first electrode members is carried out in apredetermined sequence, and a relative movement between the holdingmember and the substrate is started such that a portion of the substratethat corresponds to the first electrode members where the supplying ofvoltage was stopped first among the plurality of first electrode membersbecomes separated first from the holding surface.
 52. The exposuremethod according to claim 50, wherein after voltage has been supplied tothe plurality of first electrode members and the substrate has been madeto attract to the holding surface, the value of the voltage that issupplied to each one of the plurality of first electrode members issequentially reduced, and a relative movement between the holding memberand the substrate is started such that a portion of the substrate thatcorresponds to the first electrode members where the voltage value wasreduced first among the plurality of the first electrode members becomesseparated first from the holding surface.
 53. The exposure methodaccording to claim 50, wherein electrostatic charge on the substrate isremoved when the holding member and the substrate are being separatedfrom each other.
 54. An exposure method for exposing a substrate withexposure light, the method comprising: mounting the substrate on aholding surface of a holding member on which a first electrode member isprovided; supplying voltage to the first electrode member in order toattract the substrate to the holding surface by electrostatic force;exposing the substrate by irradiating exposure light onto the substratewhile the substrate is being held on the holding surface; and separatingthe exposed substrate and the holding surface, wherein voltage issupplied to a second electrode member that is provided on a movingmember which has a supporting surface which is capable of supporting thesubstrate in order to attract the substrate to the supporting surface bymeans of electrostatic force, and, when the supporting surface and thesubstrate are attracted together by electrostatic force, the substrateand the holding surface are separated by moving the moving member. 55.The exposure method according to claim 54, wherein the moving member ismoved such that one portion of the substrate becomes separated firstfrom the holding surface before other portions of the substrate.
 56. Anexposure method for exposing a substrate with exposure light, the methodcomprising: mounting the substrate on a holding surface of a holdingmember on which a first electrode member is provided; supplying voltageto the first electrode member in order to attract the substrate to theholding surface by means of electrostatic force; exposing the substrateby irradiating exposure light onto the substrate while the substrate isbeing held on the holding surface; and separating the exposed substrateand the holding surface, wherein electrostatic charge on the substrateis removed when the holding member and the substrate are being separatedfrom each other.
 57. (canceled)